Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.

Abstract: A polyimide is provided, which contains at least one repeating unit selected from a group consisting of the following general formulas, M, N, and O: X is a residue derived from TCA represented by formula I. Y1 is a residue derived from a diamine with a cardo structure. Y2 is a residue derived from a diamine with the structure of a benzene ring, biphenyl, phenylbenzimidazole or phenylbenzoxazole. Y3 is a residue derived from a diamine with an ether or an ester group.