Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: The present application provides a semiconductor device and the method of making the same. The method includes recessing a fin extending from a substrate, forming a base epitaxial feature on the recessed fin, forming a bar-like epitaxial feature on the base epitaxial feature, and forming a conformal epitaxial feature on the bar-like epitaxial feature. The forming of the bar-like epitaxial feature includes in-situ doping the bar-like epitaxial feature with an n-type dopant at a first doping concentration. The forming of the conformal epitaxial feature includes in-situ doping the conformal epitaxial feature with a second doping concentration greater than the first doping concentration.

Abstract: The invention uses the control circuit formed on the silicon wafer to detect the leakage current of transistor formed on the depletion mode GaN wafer and then adjust the gate voltage of the depletion mode GaN transistor according to the detected leakage current. Essentially, the gate voltage is reduced or viewed as made more negative when the detected leakage current is larger a specific value. Thus, the gate voltage can be gradually adjusted to approach a specific threshold voltage that right block the leakage current. In other words, by making the gate voltage more negative when non-zero leakage current is detected and even by making the gate voltage more positive when zero leakage current is detected, the depletion mode GaN transistor can be adjusted to have an acceptable or even zero leakage current, a high reaction rate and an optimized efficiency.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: The invention uses the control circuit formed on the silicon wafer to detect the leakage current of transistor formed on the depletion mode GaN wafer and then adjust the gate voltage of the depletion mode GaN transistor according to the detected leakage current. Essentially, the gate voltage is reduced or viewed as made more negative when the detected leakage current is larger a specific value. Thus, the gate voltage can be gradually adjusted to approach a specific threshold voltage that right block the leakage current. In other words, by making the gate voltage more negative when non-zero leakage current is detected and even by making the gate voltage more positive when zero leakage current is detected, the depletion mode GaN transistor can be adjusted to have an acceptable or even zero leakage current, a high reaction rate and an optimized efficiency.

Abstract: An article for detecting physiological function and posture status is disclosed. The article touches body directly or indirectly; wherein at least a group of non-posture physiological sensors are configured on this object and at least a switch, tension sensor, pressure sensor or pressure applicator are coupled with or touch this object; the switch, tension sensor, pressure sensor or pressure applicator are configured on a different or the same object with the physiological sensors, or divided into two parts that contact each other while external force applied; the non-posture physiological sensors sense the physiological function and posture status of the user.

Abstract: A system for analyzing gait using textile sensors is disclosed. A system includes a sock sensing system, which comprises a sock and at least one switch, tension sensor, or pressure sensor for sensing a posture or movement; and a processor configured to receive signals from the sock sensing system and to analyze a gait parameter, wherein the processor is configured to calculate the gait parameter using a signal from the sock sensing system as a trigger point.

Abstract: A system for analyzing gait using textile sensors is disclosed. A system includes a sock sensing system, which comprises a sock and at least one switch, tension sensor, or pressure sensor for sensing a posture or movement; and a processor configured to receive signals from the sock sensing system and to analyze a gait parameter, wherein the processor is configured to calculate the gait parameter using a signal from the sock sensing system as a trigger point.

Abstract: An article for detecting physiological function and posture status is disclosed. The article touches body directly or indirectly; wherein at least a group of non-posture physiological sensors are configured on this object and at least a switch, tension sensor, pressure sensor or pressure applicator are coupled with or touch this object; the switch, tension sensor, pressure sensor or pressure applicator are configured on a different or the same object with the physiological sensors, or divided into two parts that contact each other while external force applied; the non-posture physiological sensors sense the physiological function and posture status of the user.

Abstract: An electronic device which includes a resilient piece, base plate and electronic source. The upper conductor is located on the resilient piece; the base plate is connected to the resilient piece, with a space between the two. The lower conductor is located on the base plate, and there is a crevice between the lower conductor and the upper conductor. The electronic source electrically connected to the upper conductor and the lower conductor. The sensor device is located on the base plate. Utilizing this structure, the electronic device can, based on the user's needs, perform testing of the subject's physiological status or test a specific site that is pressed, be used as assist for medical equipment, exercise equipment or communications facilities.

Abstract: An electronic device which includes a resilient piece, base plate and electronic source. The upper conductor is located on the resilient piece; the base plate is connected to the resilient piece, with a space between the two. The lower conductor is located on the base plate, and there is a crevice between the lower conductor and the upper conductor. The electronic source electrically connected to the upper conductor and the lower conductor. The sensor device is located on the base plate. Utilizing this structure, the electronic device can, based on the user's needs, perform testing of the subject's physiological status or test a specific site that is pressed, be used as assist for medical equipment, exercise equipment or communications facilities.

Abstract: A blood collection set comprises essentially a syringe, a syringe cover, a flexible tube and a test tube, wherein on the top of said syringe body, there is provided protrudingly with one or more fasteners; and wherein, on the syringe cover, there are provided with several gliding slots corresponding to the number and positions of said fasteners on said syringe, wherein, on both of the front and rear ends of said gliding slots, a protruding button is provided convex in a manner that a fastening portion is formed on the front end and the rear end of said gliding slots, respectively, and wherein the base of the syringe cover is flat and is engaged with said lateral pieces of the syringe; wherein the front end of the flexible tube is connected with the rear end of the syringe, while a plastic needle is provided on the rear end of said flexible tube; and wherein an interposing structure is provided by sleeving on said flexible tube.