Patents by Inventor Tzung Hsiai

Tzung Hsiai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10736537
    Abstract: A portion of a concentric bipolar microelectrode sensor is attached to an inflatable balloon of a catheter. Another portion of the concentric bipolar microelectrode sensor is also attached to a body of the catheter. The inflatable balloon is guided to become in proximity of a tissue. The inflatable balloon is then inflated. The inflation increases the likelihood of contact between microelectrodes of the concentric bipolar microelectrode sensor with the tissue. A voltage is supplied to the microelectrodes. The tissue's impedance is accordingly measured over a frequency range. A disease of the tissue, such as a lesion, is diagnosed based on the measured impedance.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: August 11, 2020
    Assignees: CALIFORNIA INSTITUTE OF TECHNOLOGY, UNIVERSITY OF CALIFORNIA LOS ANGELES, UNIVERSITY OF SOUTHERN CALIFORNIA
    Inventors: Yu-Chong Tai, Tzung Hsiai, Yu Zhao, Xiaoxiao Zhang, Fei Yu
  • Publication number: 20170100054
    Abstract: A portion of a concentric bipolar microelectrode sensor is attached to an inflatable balloon of a catheter. Another portion of the concentric bipolar microelectrode sensor is also attached to a body of the catheter. The inflatable balloon is guided to become in proximity of a tissue. The inflatable balloon is then inflated. The inflation increases the likelihood of contact between microelectrodes of the concentric bipolar microelectrode sensor with the tissue. A voltage is supplied to the microelectrodes. The tissue's impedance is accordingly measured over a frequency range. A disease of the tissue, such as a lesion, is diagnosed based on the measured impedance.
    Type: Application
    Filed: December 28, 2015
    Publication date: April 13, 2017
    Applicants: California Institute of Technology, University of California Los Angeles, University of Southern California
    Inventors: Yu-Chong Tai, Tzung Hsiai, Yu Zhao, Xiaoxiao Zhang, Fei Yu
  • Publication number: 20060081064
    Abstract: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
    Type: Application
    Filed: August 4, 2005
    Publication date: April 20, 2006
    Inventors: Tzung Hsiai, Gopikrishnan Soundararajan, E. Kim, Hongyu Yu, Mahsa Rouhanizadeh, Tiantian Lin