Abstract: An apparatus and a manufacturing method of combining low melting point alloys and an application of low melting point alloys use a low melting point alloy (solder) as a heat-conducting medium. The solder is attached on the surface of a heat sink to define a heat-dissipating device installable onto a heat source (chip) for facilitating heat dissipations. The coefficient of thermal conduction of the solder is high, so that the heat produced by the chip can be conducted to the heat sink to give better heat dissipations of the chip. The characteristic of the low melting point alloy is used to enhance the thermal conduction for the heat source of the chip.

Abstract: A heat sink and a method for manufacturing a heat sink are described. A plate-like base is manufactured with a plurality of parallel grooves and a plurality of fins by an impact extrusion process. A high temperature heat treatment is performed to soften the plate-like base. The fins are positioned in corresponding grooves and an equal force is applied to both ends of the plate-like base so that the grooves are deformed and the fins are fixedly positioned. The method is simpler and significantly cheaper than that for conventional heat sinks.

Abstract: A chip assembly with glue-strengthening holes includes a substrate, a heat-dissipating plate and glue. A chip is arranged on the substrate. The heat-dissipating plate is made of a metal material. The heat-dissipating plate has a peripheral frame projected from a bottom thereof and a plurality of holes correspondingly formed on the peripheral frame. The heat-dissipating plate is covered on the chip. The glue is pasted between the peripheral frame of the heat-dissipating plate and the substrate, so that the glue is filled in the holes of the heat-dissipating plate for generating a griping strength.

Abstract: A heat-radiating structure of chip provides effective heat-radiating paths and also maintains good structural stability to protect chips. A bearing rack is connected beside a flip chip type chip on a circuit substrate. The bearing rack is connected with a heat-radiating sheet. A projective portion is disposed at the center of the heat-radiating sheet facing the chip. The surfaces of the projective portion and the chip are connected together through adhesive. Several grooves are disposed on the surface of the heat-radiating sheet facing the chip to reduce the weight of the heat-radiating sheet and maintain its structural rigidity. Each side of the bearing rack is not connected together to avoid regions with a too large local thermal stress. Moreover, heat-spreading paths for hot, air are also provided to prevent the heat-radiating sheet from extra stress due to hot expansion and cold shrinkage during baking in the packaging process.

Abstract: This invention relates to a radiator fin formed by sintering operation, which comprises a base board formed by means of powder metallurgical sintering and a radiator fin formed by the bent metal sheet. The base board has a plurality of equidistant trenches. The radiator fin is bent in the form of continued rectangles to form a hollow grille with multiple segments. The bottom segment of the radiator fin is milled into a slot, which is fit into the base board. The middle of the base of the said radiator fin is fit perfectly into the trench on the base board. By dint of skrinkage occurred during the sintering operation of the base board, and becomes an integral part of the base board.

Abstract: A heat dissipating device includes a lower heat sink unit and an upper heat sink unit stacked above the lower heat sink unit. The lower heat sink unit includes a base and a plurality of parallel fins extending from the base. Each of the fins has a top end distal from the base. The fins include a set of first fins and a set of second fins. Each of the first fins has a horizontal cross-section greater than that of each of the second fins. Each two adjacent ones of the first fins confine a horizontal spacing greater than that of each two adjacent ones of the second fins.

Abstract: A mold includes a top die and a bottom die moved relative to each other and defining therebetween a cavity for molding a molding of predetermined pattern, and a compacting mechanism adapted to compact the molding in the cavity, the compacting mechanism having a plurality of compacting rods adapted to compact the molding in the cavity, a pressure plate adapted to move the compacting rods into the cavity to compact the molding in the cavity, and a plurality of stop rods adapted to limit the range of movement of the pressure plate toward the bottom die.