Abstract: A memory device is provided. The memory device includes: a latch circuit, having a first inverter and a second inverter cross-coupled with each other, wherein a first pull up transistor and a first pull down transistor of the first inverter are coupled through a first selection transistor, and a second pull up transistor and a second pull down transistor of the second inverter are coupled through a second selection transistor; a first access transistor, coupled to a first storage node of the latch circuit; and a second access transistor, coupled to a second storage node of the latch circuit.

Abstract: An integrated circuit device comprises a semiconductor substrate, a first memory block on the substrate comprising NAND memory cells, a second memory block on the substrate comprising NAND memory cells, and controller circuitry. The first and second memory blocks are configurable to store data for a first pattern of data usage in response to a first operation algorithm to read, program and erase data, and for a second pattern of data usage in response to a second operation algorithm to read, program and erase data, respectively. The controller circuitry is coupled to the first and second memory blocks, and is configured to execute the first and second operation algorithms, wherein a word line pass voltage for read operations applied in the first operation algorithm is at a lower voltage level than a second word line pass voltage for read operations applied in the second operation algorithm.

Abstract: A regulator comprises an amplifier, a bias circuit, and a current trimming circuit. The bias circuit is coupled to the amplifier and supplies a first bias current to the amplifier in a first mode of a system including the regulator. The current trimming circuit is coupled to the bias circuit to adjust the first bias current.

Abstract: An integrated circuit device comprises a semiconductor substrate, a first memory block on the substrate comprising NAND memory cells, a second memory block on the substrate comprising NAND memory cells, and controller circuitry. The first and second memory blocks are configurable to store data for a first pattern of data usage in response to a first operation algorithm to read, program and erase data, and for a second pattern of data usage in response to a second operation algorithm to read, program and erase data, respectively. The controller circuitry is coupled to the first and second memory blocks, and is configured to execute the first and second operation algorithms, wherein a word line pass voltage for read operations applied in the first operation algorithm is at a lower voltage level than a second word line pass voltage for read operations applied in the second operation algorithm.

Abstract: An integrated circuit device comprises a semiconductor substrate, a first memory block on the substrate comprising NAND memory cells, a second memory block on the substrate comprising NAND memory cells, and controller circuitry. The first and second memory blocks are configurable to store data for a first pattern of data usage in response to a first operation algorithm to read, program and erase data, and for a second pattern of data usage in response to a second operation algorithm to read, program and erase data, respectively. The controller circuitry is coupled to the first and second memory blocks, and is configured to execute the first and second operation algorithms, wherein a word line pass voltage for read operations applied in the first operation algorithm is at a lower voltage level than a second word line pass voltage for read operations applied in the second operation algorithm.

Abstract: A regulator comprises an amplifier, a bias circuit, and a current trimming circuit. The bias circuit is coupled to the amplifier and supplies a first bias current to the amplifier in a first mode of a system including the regulator. The current trimming circuit is coupled to the bias circuit to adjust the first bias current.

Abstract: An integrated circuit device comprises a semiconductor substrate, a first memory block on the substrate comprising NAND memory cells, a second memory block on the substrate comprising NAND memory cells, and controller circuitry. The first and second memory blocks are configurable to store data for a first pattern of data usage in response to a first operation algorithm to read, program and erase data, and for a second pattern of data usage in response to a second operation algorithm to read, program and erase data, respectively. The controller circuitry is coupled to the first and second memory blocks, and is configured to execute the first and second operation algorithms, wherein a word line pass voltage for read operations applied in the first operation algorithm is at a lower voltage level than a second word line pass voltage for read operations applied in the second operation algorithm.

Abstract: A memory structure is provided. The memory structure includes a memory array, an error correct code (ECC) unit, and a comparator. The memory array includes at least one memory cell being written and storing at least one original data. The ECC unit is for reading at least one tested data from the at least one memory cell, correcting the at least one tested data when there is an error occurred in the at least one tested data and outputting at least one ECC data accordingly. The comparator is for determining whether the at least one original data is substantially the same as the at least one ECC data or not and outputting an output signal indicating whether the at least one memory cell passes or fails.

Abstract: A low voltage complementary metal oxide semiconductor (CMOS) process tri-state buffer includes a logic device, a biasing device and a switch device. The logic device receives an input signal and an enable signal and generates a first control signal and a second control signal. The biasing device receives the first control signal and thus controls a voltage level of a third control signal. The switch device receives the second and third control signals and respectively couples an output terminal to a first external voltage source and a second external voltage source when the second and third control signals are enabled. When the enable signal is disabled, the second and third control signals are simultaneously disabled so that the output terminal is floating with respect to the first and second external voltage sources and the output terminal is held in a high impedance state.

Abstract: A low voltage complementary metal oxide semiconductor (CMOS) process tri-state buffer includes a logic device, a biasing device and a switch device. The logic device receives an input signal and an enable signal and generates a first control signal and a second control signal. The biasing device receives the first control signal and thus controls a voltage level of a third control signal. The switch device receives the second and third control signals and respectively couples an output terminal to a first external voltage source and a second external voltage source when the second and third control signals are enabled. When the enable signal is disabled, the second and third control signals are simultaneously disabled so that the output terminal is floating with respect to the first and second external voltage sources and the output terminal is held in a high impedance state.