Patents by Inventor Tzy-Cherng Jan

Tzy-Cherng Jan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making light weight board of improved mechanical strength
    Publication number: 20040222542
    Abstract: The present invention is an extruded hollow thermoplastic sheeting, which is made of a pair of flat and parallel sheets spaced apart and interconnected by extending ribs of shifted patterns, e.g. of a sigmoid pattern, is disclosed in this invention. The thermoplastic sheeting of the invention has stronger tear strength and balanced physical properties as compared to hollow thermoplastic sheeting with extending ribs of straight pattern of the same specification. The present invention also provides a method for production thereof, wherein a fixing and cooling assembly is oscillated relative to a die, or vice versa, to create the ribs of shifted patterns.
    Type: Application
    Filed: April 26, 2004
    Publication date: November 11, 2004
    Applicant: Inteplast Group, Ltd.
    Inventors: Tzy-Cherng Jan, Jyh-yao Raphael Li, Haur-Horng Yang
  • Light weight board of improved mechanical strength and process for production thereof
    Publication number: 20030215613
    Abstract: The present invention is an extruded, hollow, thermoplastic board which is made of a pair of flat and parallel sheets spaced apart and interconnected by extending ribs of shifted patterns, eg. of a sigmoid pattern, is disclosed in this invention. The thermoplastic sheeting of the invention has stronger tear strength and balanced physical properties as compared to hollow thermoplastic boards with extending ribs of straight pattern of the same specification. The present invention also provides a method for production thereof, wherein a fixing and cooling assembly is oscillated relative to a die, or vice versa, to create the ribs of shifted patterns.
    Type: Application
    Filed: July 10, 2001
    Publication date: November 20, 2003
    Applicant: Inteplast Group, Ltd.
    Inventors: Tzy-Cherng Jan, Jyh-yao Raphael LI, Haur-Horng Yang
  • Bidirectional dimple core panel
    Patent number: D771841
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: November 15, 2016
    Assignee: Inteplast Group Corporation
    Inventors: Leo Yih Lang Chang, Phillip Wu, Tzy Cherng Jan
  • Dual layer panel
    Patent number: D772437
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: November 22, 2016
    Assignee: Inteplast Group Corporation
    Inventors: Leo Yih Lang Chang, Phillip Wu, Tzy Cherng Jan
  • Construction siding
    Patent number: D993462
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: July 25, 2023
    Assignee: INTEPLAST GROUP CORPORATION
    Inventors: Haur-Horng Yang, Tzy-Cherng Jan, Richard Ma