Patents by Inventor Tzyy-Ing WANG

Tzyy-Ing WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11314298
    Abstract: A heat dissipating device includes a bottom assembly, a first light guide positioned on the bottom assembly, a first light assembly positioned on the first light guide, and an outer cover positioned on the bottom assembly and at least partially enclosing the bottom assembly, the first light guide, and the first light assembly. The outer cover defines a first opening on a top surface thereof, at least a portion of the first light guide is received in the first opening, and light from the first light assembly is emitted from the heat dissipating device through the exposed portion of the first light guide.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: April 26, 2022
    Assignee: COOLER MASTER DEVELOPMENT CORPORATION
    Inventors: Roger Lin, Tzyy-Ing Wang
  • Publication number: 20200363849
    Abstract: A heat dissipating device includes a bottom assembly, a first light guide positioned on the bottom assembly, a first light assembly positioned on the first light guide, and an outer cover positioned on the bottom assembly and at least partially enclosing the bottom assembly, the first light guide, and the first light assembly. The outer cover defines a first opening on a top surface thereof, at least a portion of the first light guide is received in the first opening, and light from the first light assembly is emitted from the heat dissipating device through the exposed portion of the first light guide.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Roger Lin, Tzyy-Ing WANG
  • Patent number: 10768677
    Abstract: A heat dissipating device includes a bottom assembly, a first light guide positioned on the bottom assembly, a first light assembly positioned on the first light guide, and an outer cover positioned on the bottom assembly and at least partially enclosing the bottom assembly, the first light guide, and the first light assembly. The outer cover defines a first opening on a top surface thereof, at least a portion of the first light guide is received in the first opening, and light from the first light assembly is emitted from the heat dissipating device through the exposed portion of the first light guide.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: September 8, 2020
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: Roger Lin, Tzyy-Ing Wang
  • Publication number: 20190317577
    Abstract: A heat dissipating device includes a bottom assembly, a first light guide positioned on the bottom assembly, a first light assembly positioned on the first light guide, and an outer cover positioned on the bottom assembly and at least partially enclosing the bottom assembly, the first light guide, and the first light assembly. The outer cover defines a first opening on a top surface thereof, at least a portion of the first light guide is received in the first opening, and light from the first light assembly is emitted from the heat dissipating device through the exposed portion of the first light guide.
    Type: Application
    Filed: April 13, 2018
    Publication date: October 17, 2019
    Inventors: Roger Lin, Tzyy-Ing WANG
  • Patent number: D975746
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: January 17, 2023
    Assignee: COOLER MASTER DEVELOPMENT CORPORATION
    Inventors: Roger Lin, Tzyy-Ing Wang
  • Patent number: D997994
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: September 5, 2023
    Assignee: COOLER MASTER DEVELOPMENT CORPORATION
    Inventors: Roger Lin, Tzyy-Ing Wang