Patents by Inventor U. Lin

U. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • H20 PLASMA AND H20 VAPOR METHODS FOR RELEASING CHARGES
    Publication number: 20060199393
    Abstract: An in-situ performed method utilizing a pure H2O plasma to remove a layer of resist from a substrate or wafer without substantially accumulating charges thereon. Also, in-situ performed methods utilizing a pure H2O plasma or a pure H2O vapor to release or remove charges from a surface or surfaces of a substrate or wafer that have accumulated during one or more IC fabrication processes.
    Type: Application
    Filed: May 17, 2006
    Publication date: September 7, 2006
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yuan-Bang Lee, Tzu-Yang Wu, Sheng-Liang Pan, U. Lin, Yu-Chih Lai, De-Fang Chen, Pei-Hsuan Lin, Shan-Hua Wu, Hung-Hsin Liu
  • H2O plasma for simultaneous resist removal and charge releasing
    Publication number: 20050287814
    Abstract: An in-situ method of stripping a layer of resist from a substrate or wafer utilizes pure H2O plasma recipe to substantially prevent charges from accumulating on the substrate or wafer during stripping of the layer of resist.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 29, 2005
    Inventors: Yuan-Bang Lee, Tzu-Yang Wu, Sheug-Liang Pan, U. Lin, Yu-Chih Lai, De-Fang Chen