Patents by Inventor Uasuhiro Tomita

Uasuhiro Tomita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing method for semiconductor wafer
    Publication number: 20070059935
    Abstract: A polishing method includes a slurry adjusting step for adjusting a polishing slurry containing silica particles so that the number of silica particles having a composition ratio of Si/O of 50-60 wt %/40-50 wt %, a modulus of elasticity of 1.4×1010 Pa or higher and a particle size of 1 ?m or larger is 3000 pcs/ml or less. A semiconductor wafer is polished using the polishing slurry adjusted in the slurry adjusting step.
    Type: Application
    Filed: August 30, 2006
    Publication date: March 15, 2007
    Applicant: KOMATSU ELECTRONIC METALS CO., LTD.
    Inventors: Kazuaki Kozasa, Motoharu Yamada, Uasuhiro Tomita, Hiromi Wakabayashi