Patents by Inventor Ubaldo Robles

Ubaldo Robles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D volumetric circuits and associated methods
    Patent number: 10974443
    Abstract: A method, system, and apparatus for fabricating a three-dimensional circuit is provided. In an embodiment, a method for fabricating a three-dimensional circuit by an additive manufacturing process includes determining a shape, location, and spatial orientation of a number of components, a number of dielectrics, and a number of metal interconnects for the three dimensional circuit. The method also includes obtaining fused filament fabrication (FFF) specific actions for a number of dielectric materials and the metal interconnects. The method also includes separating tool paths of the dielectric material and the metal interconnects into individual tool paths for each of the dielectric materials and the metal interconnects. The method also includes removing specific actions for one of the individual toolpaths from an FFF specific action. The method also includes rewriting the one of the individual toolpaths into micro-dispensing actions to control a tool for micro-dispensing ink.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: April 13, 2021
    Assignee: Board of Regents, The University of Texas System
    Inventors: Raymond C. Rumpf, Cesar Luis Valle, Gilbert Carranza, Ubaldo Robles
  • 3D VOLUMETRIC CIRCUITS AND ASSOCIATED METHODS
    Publication number: 20200254683
    Abstract: A method, system, and apparatus for fabricating a three-dimensional circuit is provided. In an embodiment, a method for fabricating a three-dimensional circuit by an additive manufacturing process includes determining a shape, location, and spatial orientation of a number of components, a number of dielectrics, and a number of metal interconnects for the three dimensional circuit. The method also includes obtaining fused filament fabrication (FFF) specific actions for a number of dielectric materials and the metal interconnects. The method also includes separating tool paths of the dielectric material and the metal interconnects into individual tool paths for each of the dielectric materials and the metal interconnects. The method also includes removing specific actions for one of the individual toolpaths from an FFF specific action. The method also includes rewriting the one of the individual toolpaths into micro-dispensing actions to control a tool for micro-dispensing ink.
    Type: Application
    Filed: November 8, 2019
    Publication date: August 13, 2020
    Inventors: Raymond C. Rumpf, Cesar Luis Valle, Gilbert Carranza, Ubaldo Robles