Patents by Inventor Ubed Mohammed

Ubed Mohammed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12690160
    Abstract: The hexagonal heatsink system introduces a novel approach to efficient electronic device cooling. It includes heatsink devices, each with an electronic circuit board and heatsink elements for heat transfer, all attached via a hexagonal base plate with fins for enhanced cooling. Temperature sensors are placed near processors strategically to monitor temperature values. The system employs a feedback circuit that collects sensor data, calculates an effective temperature, and regulates a fan based on the comparison with a threshold temperature. It can control additional fan parameters, such as speed. This system offers an effective solution for maintaining optimal operating temperatures in electronic devices, particularly those with hexagonal base plates, improving overall device reliability and preventing overheating even in server racks.
    Type: Grant
    Filed: November 30, 2023
    Date of Patent: July 21, 2026
    Assignee: LightSpeed Photonics Pte Ltd
    Inventors: Venkata Ramana Pamidighantam, Ubed Mohammed, Rohin Kumar Yeluripati
  • Publication number: 20260100761
    Abstract: The present invention relates to a compact multi-channel optical transceiver system configured for high-speed, bidirectional optical communication in a surface-mountable form factor. The system comprises a compact optical transceiver module having a substrate embedded with a driver integrated circuit, a transimpedance amplifier, a plurality of transmitter engines, a first plurality of receiver engines, and a microcontroller. High-speed electrical connectivity is achieved through embedded high-speed lanes and wire bonds. A Mechanical Optical Interface (MOI) is positioned above the substrate for precise optical alignment. A ferrule holds a plurality of optical fibers in alignment with the MOI, and a clip secures the ferrule to maintain stable optical coupling. The first end of the optical fibers interfaces with the MOI, while the second end connects to an external optical connector, enabling seamless integration with external optical systems.
    Type: Application
    Filed: October 7, 2025
    Publication date: April 9, 2026
    Applicant: LIGHTSPEED PHOTONICS PVT. LTD.
    Inventors: Rohin Kumar Yeluripati, Ramana Venkata Pamidighantam, Nikhil Kumar Aare, Ubed Mohammed, Jinin K Jose, Kiran SG
  • Publication number: 20240179869
    Abstract: The hexagonal heatsink system introduces a novel approach to efficient electronic device cooling. It includes heatsink devices, each with an electronic circuit board and heatsink elements for heat transfer, all attached via a hexagonal base plate with fins for enhanced cooling. Temperature sensors are placed near processors strategically to monitor temperature values. The system employs a feedback circuit that collects sensor data, calculates an effective temperature, and regulates a fan based on the comparison with a threshold temperature. It can control additional fan parameters, such as speed. This system offers an effective solution for maintaining optimal operating temperatures in electronic devices, particularly those with hexagonal base plates, improving overall device reliability and preventing overheating even in server racks.
    Type: Application
    Filed: November 30, 2023
    Publication date: May 30, 2024
    Inventors: Venkata Ramana Pamidighantam, Ubed Mohammed, Rohin Kumar Yeluripati