Patents by Inventor Ubol A. Udompanyavit

Ubol A. Udompanyavit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE
    Publication number: 20140175626
    Abstract: An integrated circuit package has a leadframe having an open space extending therethrough. An integrated circuit device is attached to a portion of the upper surface of the leadframe. A shunt is located within the open space such that it is not in contact with any portion of the leadframe.
    Type: Application
    Filed: February 25, 2014
    Publication date: June 26, 2014
    Applicant: Texas Instruments Incorporated
    Inventors: Donald C. Abbott, Ubol A. Udompanyavit, Brian E. Parks