Patents by Inventor Uday Anumalachetty

Uday Anumalachetty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced power distribution in an integrated circuit
    Patent number: 7760578
    Abstract: An integrated circuit structure for distributing power to one or more standard cells in an integrated circuit includes a first plurality of standard cells and a power mesh power connection structure coupled to the cells. Each of the standard cells includes first and second power rails adapted for connection to a voltage supply and a voltage return, respectively, of the standard cells. Each standard cell in a subset of the standard cells is arranged in direct abutment with at least two other standard cells, and at least first and second end cells are arranged in direct abutment with at least one other standard cell of the first plurality of standard cells. The power mesh power connection structure includes a plurality of conductive elements formed in a plurality of different conductive layers in the integrated circuit.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: July 20, 2010
    Assignee: LSI Logic Corporation
    Inventors: David Vinke, Michael N. Dillon, Bret Alan Oeltjen, Uday Anumalachetty, Thomas Mathews Antisseril
  • Enhanced Power Distribution in an Integrated Circuit
    Publication number: 20100097875
    Abstract: An integrated circuit structure for distributing power to one or more standard cells in an integrated circuit includes a first plurality of standard cells and a power mesh power connection structure coupled to the cells. Each of the standard cells includes first and second power rails adapted for connection to a voltage supply and a voltage return, respectively, of the standard cells. Each standard cell in a subset of the standard cells is arranged in direct abutment with at least two other standard cells, and at least first and second end cells are arranged in direct abutment with at least one other standard cell of the first plurality of standard cells. The power mesh power connection structure includes a plurality of conductive elements formed in a plurality of different conductive layers in the integrated circuit.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 22, 2010
    Inventors: David Vinke, Michael N. Dillon, Bret Alan Oeltjen, Uday Anumalachetty, Thomas Mathews Antisseril