Patents by Inventor Uday Mahajan
Uday Mahajan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230057981Abstract: A system (1) of hot plates (2, 3) includes more than one hot plates (2, 3), a heating medium (4) which heats the hot plates (2, 3), and a cooking medium dispensing means (5). The hot plates (2, 3) have at least one of the plates as an upper plate (2) and at least one of another plate as a lower plate (3), wherein the upper plate (2) and the lower plate (3) are functionally coupled to press and heat a food item when the food item is placed between the plates (2, 3). The cooking medium dispensing unit/component/etc. (5) dispenses a predefined quantity of the cooking medium at least on an upper surface of the food item, or a lower surface of the food item.Type: ApplicationFiled: April 12, 2021Publication date: February 23, 2023Applicant: REBEL FOODS PRIVATE LIMITEDInventors: Uday MAHAJAN, Ashish Deelip GHATGE, Neelaabh Rabindra PAL, Soumyadeep BARMAN, Vijay Premshankar PANDEY, Sudeshna TRILOK, Dalyn Peter FERNANDES, Jayakumar B, Kamendra Singh CHAHAR, Pankaj YADAV, Prasenjit DAWN, Salil P SAPRE, Sachin Mohan KORDE, Vamsi Krishna MUDUMBA, Vishal SINGH
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Publication number: 20230056269Abstract: A stir fryer (1) which includes a pot (2) having a cavity to place ingredients to stir fry the ingredients, and which can be rotated, a heating medium (3) functionally coupled to the pot (2) to heat the pot (2), a rotational means (4) functionally coupled to the pot (2) to rotate the pot (2) symmetrically or eccentrically about an axis, and a rotation regulator (5) which regulates the rotational unit/component/etc. (4) to further regulate speed of rotation of the pot (2).Type: ApplicationFiled: April 12, 2021Publication date: February 23, 2023Applicant: REBEL FOODS PRIVATE LIMITEDInventors: Uday MAHAJAN, Ashish Deelip GHATGE, Neelaabh Rabindra PAL, Soumyadeep BARMAN, Vijay Premshankar PANDEY, Sudeshna TRILOK, Ankush GROVER
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Publication number: 20170298252Abstract: A slurry for chemical mechanical planarization includes a surfactant, and abrasive particles having an average diameter between 20 and 30 nm and an outer surface of ceria. The abrasive particles are formed using a hydrothermal synthesis process. The abrasive particles are between 0.1 and 3 wt % of the slurry.Type: ApplicationFiled: October 9, 2015Publication date: October 19, 2017Inventors: Ranga Rao Arnepalli, Robert Jan Visser, Rajeev Bajaj, Darshan Thakare, Prerna Goradia, Uday Mahajan, Abdul Wahab Mohammed
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Publication number: 20160013085Abstract: A method of controlling chemical mechanical polishing includes polishing a substrate having a plurality of protrusions, monitoring the substrate during polishing with an in-situ monitoring system to generate a signal, the in-situ monitoring system including an acoustic sensor, a motor current sensor or a motor torque sensor, and detecting breakage of the protrusions based on the signal.Type: ApplicationFiled: July 10, 2014Publication date: January 14, 2016Inventors: Xiong Yeu Chew, Venaka Rama Subrahmanyam Kommisetti, Uday Mahajan, Boguslaw A. Swedek, Rajeev Bajaj, Jianshe Tang
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Patent number: 9219044Abstract: Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact bumps are formed in the locations at which the photoresist is removed. A temporary carrier is attached to the photoresist over the wafer. The back side of the wafer opposite the contact bumps is processed while handling the wafer using the temporary carrier. The temporary carrier is removed. The photoresist on the front side of the wafer with the contact bumps is removed after removing the temporary carrier.Type: GrantFiled: November 18, 2013Date of Patent: December 22, 2015Assignee: APPLIED MATERIALS, INC.Inventors: Chin Hock Toh, Aksel Kitowski, Uday Mahajan, Thean Ming Tan
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Patent number: 9202801Abstract: Thin substrates and mold compound handling is described using an electrostatic-chucking carrier. In one example, a first part of a plurality of silicon chip packages is formed on a front side of a silicon substrate wafer at a first processing station. An a carrier wafer of an electrostatic chuck is attached over the front side of the silicon wafer. The substrate wafer is moved to a second processing station. A second part of the plurality of silicon chip packages are formed on a back side of the silicon wafer at a second processing station. The electrostatic chuck is then released.Type: GrantFiled: November 18, 2013Date of Patent: December 1, 2015Assignee: APPLIED MATERIALS, INC.Inventors: Chin Hock Toh, Uday Mahajan, Aksel Kitowski
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Publication number: 20150137383Abstract: Thin substrates and mold compound handling is described using an electrostatic-chucking carrier. In one example, a first part of a plurality of silicon chip packages is formed on a front side of a silicon substrate wafer at a first processing station. An a carrier wafer of an electrostatic chuck is attached over the front side of the silicon wafer. The substrate wafer is moved to a second processing station. A second part of the plurality of silicon chip packages are formed on a back side of the silicon wafer at a second processing station. The electrostatic chuck is then released.Type: ApplicationFiled: November 18, 2013Publication date: May 21, 2015Inventors: Chin Hock Toh, Uday Mahajan, Aksel Kitowski
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Publication number: 20150140801Abstract: Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact bumps are formed in the locations at which the photoresist is removed. A temporary carrier is attached to the photoresist over the wafer. The back side of the wafer opposite the contact bumps is processed while handling the wafer using the temporary carrier. The temporary carrier is removed. The photoresist on the front side of the wafer with the contact bumps is removed after removing the temporary carrier.Type: ApplicationFiled: November 18, 2013Publication date: May 21, 2015Inventors: Chin Hock Toh, Aksel Kitowski, Uday Mahajan, Thean Ming Tan
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Publication number: 20150099432Abstract: Embodiments described herein generally relate to devices and methods for magnetic-responsive chemical mechanical polishing. In one embodiment, a device including a support with one or more magnetic field generators formed therein is provided. The magnetic field generators can produce at least one magnetic field. A magnetic-responsive composite is positioned in magnetic connection with the magnetic field generators. When the magnetic-responsive composite receives the magnetic field from the magnetic field generators, the magnetic-responsive composite changes shape.Type: ApplicationFiled: September 11, 2014Publication date: April 9, 2015Inventors: Uday MAHAJAN, Rajeev BAJAJ, Fred Conrad REDEKER, Abdul Wahab MOHAMMED
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APPARATUS AND METHODS FOR ACOUSTICAL MONITORING AND CONTROL OF THROUGH-SILICON-VIA REVEAL PROCESSING
Publication number: 20140329439Abstract: A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic emissions received by one or more acoustic sensors positioned proximate a substrate holder and/or a polishing pad of a CMP system may be analyzed to detect TSV breakage during a CMP process. In response to detecting TSV breakage, one or more remedial actions may automatically occur. In some embodiments, a polishing pad platen may have one or more acoustic sensors integrated therein that extend into a polishing pad mounted on the polishing pad platen. Methods of monitoring and controlling a TSV reveal process are also provided, as are other aspects.Type: ApplicationFiled: May 1, 2013Publication date: November 6, 2014Inventors: Xiong Yeu Chew, Kommisetti Subrahmanyam, Uday Mahajan, Bogdan Swedek, Rajeev Bajaj, Jianshe Tang -
Patent number: 8071420Abstract: The present invention provides a method and apparatus for edge film stack removal process for fabricating photovoltaic devices. In one embodiment, a method for manufacturing solar cell devices on a substrate includes providing a substrate into a chemical vapor deposition chamber, contacting a shadow frame disposed in the deposition chamber to a periphery region of the substrate, depositing a silicon-containing layer on the substrate through an aperture defined by the shadow frame, transferring the substrate to a physical vapor deposition chamber, depositing a transparent conductive layer on the silicon-containing layer, transferring the substrate to a laser edge removal tool, and laser scribing the layers formed on the periphery region of the substrate.Type: GrantFiled: December 14, 2009Date of Patent: December 6, 2011Assignee: Applied Materials, Inc.Inventors: Tzay-Fa Su, David Morishige, Todd Martin, Uday Mahajan
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Publication number: 20110008947Abstract: Embodiments of the present invention generally relate to a system used to form solar cell devices using processing modules adapted to perform one or more processes in the formation of the solar cell devices. In one embodiment, the system is adapted to form thin film solar cell devices by accepting a large unprocessed substrate and performing multiple deposition, material removal, cleaning, bonding, testing, and sectioning processes to form one or more complete, functional, and tested solar cell devices in custom sizes and/or shapes that can then be shipped to an end user for installation in a desired location to generate electricity. In one embodiment, the system is adapted to form one or more BIPV panels in custom sizes and/or shapes from a single large substrate for shipment to an end user.Type: ApplicationFiled: June 17, 2010Publication date: January 13, 2011Applicant: APPLIED MATERIALS, INC.Inventors: KEVIN LAUGHTON CUNNINGHAM, Carl Treadwell, Tzay-Fa Su, Uday Mahajan, Sarin Sundar Jainnagar Kuppuswamy
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Publication number: 20100159634Abstract: The present invention provides a method and apparatus for edge film stack removal process for fabricating photovoltaic devices. In one embodiment, a method for manufacturing solar cell devices on a substrate includes providing a substrate into a chemical vapor deposition chamber, contacting a shadow frame disposed in the deposition chamber to a periphery region of the substrate, depositing a silicon-containing layer on the substrate through an aperture defined by the shadow frame, transferring the substrate to a physical vapor deposition chamber, depositing a transparent conductive layer on the silicon-containing layer, transferring the substrate to a laser edge removal tool, and laser scribing the layers formed on the periphery region of the substrate.Type: ApplicationFiled: December 14, 2009Publication date: June 24, 2010Inventors: TZAY-FA SU, David Morishige, Todd Martin, Uday Mahajan
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Publication number: 20090014683Abstract: A selective polish for fabricating electronic devices is disclosed. The selective polish may include the use of a slurry that facilitates the selective polish of a first component but does not substantially polish a second component.Type: ApplicationFiled: September 24, 2008Publication date: January 15, 2009Inventors: Liming Zhang, Uday Mahajan
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Patent number: 7446046Abstract: A selective polish for fabricating electronic devices is disclosed. The selective polish may include the use of a slurry that facilitates the selective polish of a first component but does not substantially polish a second component.Type: GrantFiled: January 6, 2005Date of Patent: November 4, 2008Assignee: Intel CorporationInventors: Liming Zhang, Uday Mahajan
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Publication number: 20060148260Abstract: A selective polish for fabricating electronic devices is disclosed. The selective polish may include the use of a slurry that facilitates the selective polish of a first component but does not substantially polish a second component.Type: ApplicationFiled: January 6, 2005Publication date: July 6, 2006Inventors: Liming Zhang, Uday Mahajan