Patents by Inventor Uday Pai

Uday Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210143320
    Abstract: A piezoelectric device includes a substrate, a thermal oxide layer on the substrate, a metal or metal oxide adhesion layer on the thermal oxide layer, a lower electrode on the metal oxide adhesion layer, a seed layer on the lower electrode, a lead magnesium niobate-lead titanate (PMNPT) piezoelectric layer on the seed layer, and an upper electrode on the PMNPT piezoelectric layer.
    Type: Application
    Filed: November 21, 2019
    Publication date: May 13, 2021
    Inventors: Abhijeet Laxman Sangle, Vijay Bhan Sharma, Yuan Xue, Uday Pai, Bharatwaj Ramakrishnan, Ankur Kadam
  • Patent number: 10199204
    Abstract: Embodiments of target retaining apparatus and substrate processing chambers incorporating same are provided herein. In some embodiments, a target retaining apparatus includes a housing including a first slot and a second slot; a cam movably disposed in the housing, wherein movement of the cam is constrained along the first slot; a retaining arm movably coupled to the cam, wherein movement of the retaining arm is constrained along the second slot; a linking member including a first end rotatably coupled to the cam and a second end rotatably coupled to the retaining arm; and a biasing element biasing the cam towards a first position in which the retaining arm extends away from the housing.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: February 5, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Srinivasa Yedla, Sundarapandian Reddy, Uday Pai, Kirankumar Savandaiah, Thanh X. Nguyen, Muhammad M. Rasheed, Jallepally Ravi
  • Patent number: 9960021
    Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: May 1, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Uday Pai, William Fruchterman, Keith A. Miller, Muhammad M. Rasheed, Thanh X. Nguyen, Kirankumar Savandaiah
  • Patent number: 9343274
    Abstract: Apparatus for processing substrates is disclosed herein. In some embodiments, an apparatus includes a first shield having a first end, a second end, and one or more first sidewalls disposed between the first and second ends, wherein the first end is configured to interface with a first support member of a process chamber to support the first shield in a position such that the one or more first sidewalls surround a first volume of the process chamber; and a second shield having a first end, a second end, and one or more second sidewalls disposed between the first and second ends of the second shield and about the first shield, wherein the first end of the second shield is configured to interface with a second support member of the process chamber to support the second shield such that the second shield contacts the first shield to form a seal therebetween.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: May 17, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Muhammad Rasheed, Donny Young, Kirankumar Savandaiah, Uday Pai
  • Patent number: 9303311
    Abstract: Substrate processing systems are provided herein. In some embodiments, a substrate processing system may include a target assembly having a target comprising a source material to be deposited on a substrate; a grounding assembly disposed about the target assembly and having a first surface that is generally parallel to and opposite a backside of the target assembly; a support member coupled to the grounding assembly to support the target assembly within the grounding assembly; one or more insulators disposed between the backside of the target assembly and the first surface of the grounding assembly; and one or more biasing elements disposed between the first surface of the grounding assembly and the backside of the target assembly to bias the target assembly toward the support member.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: April 5, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Donny Young, Alan Ritchie, Uday Pai, Muhammad Rasheed, Keith A. Miller
  • Publication number: 20150203960
    Abstract: Embodiments of target retaining apparatus and substrate processing chambers incorporating same are provided herein. In some embodiments, a target retaining apparatus includes a housing including a first slot and a second slot; a cam movably disposed in the housing, wherein movement of the cam is constrained along the first slot; a retaining arm movably coupled to the cam, wherein movement of the retaining arm is constrained along the second slot; a linking member including a first end rotatably coupled to the cam and a second end rotatably coupled to the retaining arm; and a biasing element biasing the cam towards a first position in which the retaining arm extends away from the housing.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 23, 2015
    Inventors: SRINIVASA YEDLA, SUNDARAPANDIAN REDDY, UDAY PAI, KIRANKUMAR SAVANDAIAH, THANH X. NGUYEN, MUHAMMAD M. RASHEED, JALLEPALLY RAVI
  • Publication number: 20150170888
    Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
    Type: Application
    Filed: February 18, 2014
    Publication date: June 18, 2015
    Applicant: APPLIED MATERIALS, INC.
    Inventors: MARTIN LEE RIKER, UDAY PAI, WILLIAM FRUCHTERMAN, KEITH A. MILLER, MUHAMMAD M. RASHEED, THANH X. NGUYEN, KIRANKUMAR SAVANDAIAH
  • Publication number: 20140158049
    Abstract: Apparatus for processing substrates is disclosed herein. In some embodiments, an apparatus includes a first shield having a first end, a second end, and one or more first sidewalls disposed between the first and second ends, wherein the first end is configured to interface with a first support member of a process chamber to support the first shield in a position such that the one or more first sidewalls surround a first volume of the process chamber; and a second shield having a first end, a second end, and one or more second sidewalls disposed between the first and second ends of the second shield and about the first shield, wherein the first end of the second shield is configured to interface with a second support member of the process chamber to support the second shield such that the second shield contacts the first shield to form a seal therebetween.
    Type: Application
    Filed: February 11, 2014
    Publication date: June 12, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: MUHAMMAD RASHEED, DONNY YOUNG, KIRANKUMAR SAVANDAIAH, UDAY PAI
  • Patent number: 8702918
    Abstract: In some embodiments, substrate processing apparatus may include a chamber body; a lid disposed atop the chamber body; a target assembly coupled to the lid, the target assembly including a target of material to be deposited on a substrate; an annular dark space shield having an inner wall disposed about an outer edge of the target; a seal ring disposed adjacent to an outer edge of the dark space shield; and a support member coupled to the lid proximate an outer end of the support member and extending radially inward such that the support member supports the seal ring and the annular dark space shield, wherein the support member provides sufficient compression when coupled to the lid such that a seal is formed between the support member and the seal ring and the seal ring and the target assembly.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: April 22, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Alan Ritchie, Donny Young, Keith A. Miller, Muhammad Rasheed, Steve Sansoni, Uday Pai
  • Patent number: 8647485
    Abstract: Apparatus for processing substrates is disclosed herein. In some embodiments, an apparatus includes a first shield having a first end, a second end, and one or more first sidewalls disposed between the first and second ends, wherein the first end is configured to interface with a first support member of a process chamber to support the first shield in a position such that the one or more first sidewalls surround a first volume of the process chamber; and a second shield having a first end, a second end, and one or more second sidewalls disposed between the first and second ends of the second shield and about the first shield, wherein the first end of the second shield is configured to interface with a second support member of the process chamber to support the second shield such that the second shield contacts the first shield to form a seal therebetween.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: February 11, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Muhammad Rasheed, Donny Young, Kirankumar Savandaiah, Uday Pai
  • Publication number: 20130256125
    Abstract: Substrate processing systems are provided herein. In some embodiments, a substrate processing system may include a target assembly having a target comprising a source material to be deposited on a substrate; a grounding assembly disposed about the target assembly and having a first surface that is generally parallel to and opposite a backside of the target assembly; a support member coupled to the grounding assembly to support the target assembly within the grounding assembly; one or more insulators disposed between the backside of the target assembly and the first surface of the grounding assembly; and one or more biasing elements disposed between the first surface of the grounding assembly and the backside of the target assembly to bias the target assembly toward the support member.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: DONNY YOUNG, ALAN RITCHIE, UDAY PAI, MUHAMMAD RASHEED, KEITH A. MILLER
  • Publication number: 20130255576
    Abstract: Apparatus for processing substrates is disclosed herein. In some embodiments, an apparatus includes a first shield having a first end, a second end, and one or more first sidewalls disposed between the first and second ends, wherein the first end is configured to interface with a first support member of a process chamber to support the first shield in a position such that the one or more first sidewalls surround a first volume of the process chamber; and a second shield having a first end, a second end, and one or more second sidewalls disposed between the first and second ends of the second shield and about the first shield, wherein the first end of the second shield is configured to interface with a second support member of the process chamber to support the second shield such that the second shield contacts the first shield to form a seal therebetween.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: MUHAMMAD RASHEED, DONNY YOUNG, KIRANKUMAR SAVANDAIAH, UDAY PAI
  • Publication number: 20130153412
    Abstract: In some embodiments, substrate processing apparatus may include a chamber body; a lid disposed atop the chamber body; a target assembly coupled to the lid, the target assembly including a target of material to be deposited on a substrate; an annular dark space shield having an inner wall disposed about an outer edge of the target; a seal ring disposed adjacent to an outer edge of the dark space shield; and a support member coupled to the lid proximate an outer end of the support member and extending radially inward such that the support member supports the seal ring and the annular dark space shield, wherein the support member provides sufficient compression when coupled to the lid such that a seal is formed between the support member and the seal ring and the seal ring and the target assembly.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 20, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: ALAN RITCHIE, DONNY YOUNG, KEITH A. MILLER, MUHAMMAD RASHEED, STEVE SANSONI, Uday Pai
  • Publication number: 20110164955
    Abstract: Embodiments of a method and apparatus for processing large area substrates including a translational wear plate and/or bushing assembly are provided for reducing the stress on a lift pin used to space substrates from a substrate support in a processing or other type of chamber. In another embodiment, an apparatus for processing substrates includes processing chamber comprising a substrate support disposed in a chamber body. A bushing assembly is disposed in the substrate support. A lift pin is disposed through the bushing assembly. A wear plate is provided that is coupled to the chamber body and aligned with the lift pin. The wear plate is movable laterally relative to a centerline of the chamber body to accommodate lateral motion of the lift pin when contacting the wear plate.
    Type: Application
    Filed: July 13, 2010
    Publication date: July 7, 2011
    Applicant: APPLIED MATERIALS,INC.
    Inventors: John M. White, Jeonghoon Oh, Tom K. Cho, Silja James, Uday Pai, Oscar Lopez, Alexander S. Polyak