Patents by Inventor Udaya Patri

Udaya Patri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing slurries and methods for chemical mechanical polishing
    Publication number: 20070043230
    Abstract: Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent. Methods for polishing copper by chemical-mechanical planarization include polishing copper with low pressures using a polishing pad and a aqueous slurries including soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent, particles of MoO3 dissolved in an oxidizing agent, and particles of MoO2 dissolved in an oxidizing agent.
    Type: Application
    Filed: September 26, 2006
    Publication date: February 22, 2007
    Inventors: Sunil Jha, Sreehari Nimmala, Sharath Hegde, Youngki Hong, S.V. Babu, Udaya Patri
  • Polishing slurries and methods for chemical mechanical polishing
    Publication number: 20070023731
    Abstract: Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent. Methods for polishing copper by chemical-mechanical planarization include polishing copper with low pressures using a polishing pad and a aqueous slurries including soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent, particles of MoO3 dissolved in an oxidizing agent, and particles of MoO2 dissolved in an oxidizing agent.
    Type: Application
    Filed: September 29, 2006
    Publication date: February 1, 2007
    Inventors: Sunil Jha, Sreehari Nimmala, Sharath Hedge, Youngki Hong, S.V. Babu, Udaya Patri
  • Polishing slurries and methods for chemical mechanical polishing
    Publication number: 20050211953
    Abstract: Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent. Methods for polishing copper by chemical-mechanical planarization include polishing copper with low pressures using a polishing pad and a aqueous slurries including soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent, particles of MoO3 dissolved in an oxidizing agent, and particles of MoO2 dissolved in an oxidizing agent.
    Type: Application
    Filed: January 11, 2005
    Publication date: September 29, 2005
    Inventors: Sunil Jha, Sreehari Nimmala, Sharath Hegde, Youngki Hong, S.V. Babu, Udaya Patri
  • Slurry and method for chemical-mechanical planarization of copper
    Publication number: 20050026444
    Abstract: The claimed invention involves a novel aqueous slurry for chemical-mechanical planarization that is effective for polishing copper at high polish rates. The aqueous slurry according to the present invention comprises particles of MoO3 dissolved in an oxidizing agent. A method for polishing copper by chemical-mechanical planarization includes contacting copper with a polishing pad and an aqueous slurry comprising particles of MoO3 dissolved in an oxidizing agent.
    Type: Application
    Filed: May 13, 2004
    Publication date: February 3, 2005
    Inventors: S. Babu, Sharath Hegde, Sunil Jha, Udaya Patri, Youngki Hong