Abstract: A method for process control which uses discrete lots in which each lot is uniquely identified. The process is modeled with a precedence rule which allows concurrent processing of each discrete lot. Lots are processed simultaneously within different processing steps in such a way as to maintain the unity of the lot while tracking the lot at all times during processing.

Abstract: A method for controlling production lots which deals with production lots comprising a plurality of discrete units distributed among a plurality of locations. A first event is triggered when a first unit from a first production lot enters a processing step. A second event is triggered when a last unit from the first production lot leaves the processing step.

Abstract: A semiconductor chip module is formed by providing at least one semiconductor chip and a semiconductor substrate and bonding the semiconductor chip to the semiconductor substrate without the use of an epoxy or a metallic layer to create a bond between the semiconductor chip and the semiconductor substrate. The semiconductor chip of the semiconductor chip module is electrically connected to an external, electrical interconnection system. The semiconductor substrate has similar thermal properties to the semiconductor chip, this thermal mismatch present between a semiconductor chip and a metallic heatsink in conventional external, electrical interconnection systems is eliminated.

Abstract: A plastic package (10) with a heat sink (11, 27, 28, 32) has a stress relief wall (18, 21, 33) formed on its upper surface. A semiconductor die (12) is mounted on the heat sink (11, 27, 28, 32) such that the top of a semiconductor die (12) is below the level of the top of the wall (18, 21, 33), and the wall (18, 21, 33) absorbs stresses which otherwise would be applied to the semiconductor die (12). The package (10) is simple to fabricate and assemble, and provides a mold lock (23, 24, 31) which serves to hold the plastic material (13) tightly to the heat sink (11, 27, 28, 32). Extra die bond material (26) can be used to increase heat flow without compromising other characteristics of the package (10).

Abstract: A layer of aluminum is formed on a surface of a thermal expansion buffer which is used in a semiconductor package. A semiconductor die is attached to the aluminum using a die attach material. An electrical connection for the die is created by attaching a wire from the semiconductor die to the aluminum surface of the buffer. This provides a reliable semiconductor package useful in a high temperature environment.