Abstract: An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.

Abstract: According to embodiments of the present invention, a balun is disposed on a package that is to receive a die. In embodiments, the balun includes a first metal trace disposed on a first base and a second metal trace disposed on a second base. In embodiments, the first metal trace is one-quarter wavelength of an operating wavelength for a radio frequency (RF) signal and the second metal trace is three-quarters wavelength of the wavelength.

Abstract: According to embodiments of the present invention, a balun is disposed on a package that is to receive a die. In embodiments, the balun includes a first metal trace disposed on a first base and a second metal trace disposed on a second base. In embodiments, the first metal trace is one-quarter wavelength of an operating wavelength for a radio frequency (RF) signal and the second metal trace is three-quarters wavelength of the wavelength.

Abstract: An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.

Abstract: An integrated circuit package that is coupled to a printed circuit board by a socket assembly. The socket assembly has a plurality of pins that are mounted to the circuit board. The pins are coupled to corresponding conductive sockets and outer rings of the socket assembly. The package contains an integrated circuit that is coupled to external pins which extend from a bottom surface of the package housing. The package also has a plurality of conductive rings that are located on the bottom surface of the housing and are electrically coupled to the integrated circuit. To install the package, the package pins are inserted into the individual sockets of the socket assembly. Insertion of the pins also presses the conductive rings of the package onto the corresponding outer rings of the socket. The conductive rings are typically dedicated to the power and ground pins of the system, wherein the integrated circuit receives power through the rings.