Patents by Inventor Udy A. Shrivastava

Udy A. Shrivastava has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ground plane for integrated circuit package
    Patent number: 7154175
    Abstract: An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: December 26, 2006
    Assignee: Intel Corporation
    Inventors: Udy A. Shrivastava, Kristopher Frutschy