Abstract: A structure of plug-in light string is provided, including a light shell, a separation element, an LED and a plurality of wires. The two metal leads extended from the LED are soldered to respective wires. The top of the separation element presses against the bottom of the LED, and the separation element and the LED are plugged into the light shell. The LED extends partially from the top opening of the light shell, and the separation element is buckled to the light shell to fasten the position of each component. Inside the light shell, the separation element separates the connection segments of the two metal leads and the wires. In this manner, the structure of plug-in light string is constituted to achieve advantages of easy assembly, water-proof effect, safe usage and small size.

Abstract: A structure of plug-in light string is provided, including a light shell, a separation element, an LED and a plurality of wires. The two metal leads extended from the LED are soldered to respective wires. The top of the separation element presses against the bottom of the LED, and the separation element and the LED are plugged into the light shell. The LED extends partially from the top opening of the light shell, and the separation element is buckled to the light shell to fasten the position of each component. Inside the light shell, the separation element separates the connection segments of the two metal leads and the wires. In this manner, the structure of plug-in light string is constituted to achieve advantages of easy assembly, water-proof effect, safe usage and small size.

Abstract: A structure for LED Christmas light is provided, including a light holder, being a hollow body having a separating part connected to the inner wall of the light holder to divide the hollow interior of the light holder into two cavities. Each of the two opposite sides of the inner wall of the light holder connected to the separating part forms a slot and face the surface of the separating part of the two cavities, with each having a guiding channel. Two wire sets are fixed inside the two cavities. An LED light bulb has a positive pin and a negative pin inserted inside the guiding channel, respectively, and being electrically connected to the wire sets. A light cap has a holding part passing the LED light bulb to tightly engage to the top of the light holder so as to fix the LED light bulb to the light holder.

Abstract: A structure for LED Christmas light is provided, including a light holder, being a hollow body having a separating part connected to the inner wall of the light holder to divide the hollow interior of the light holder into two cavities. Each of the two opposite sides of the inner wall of the light holder connected to the separating part forms a slot and face the surface of the separating part of the two cavities, with each having a guiding channel. Two wire sets are fixed inside the two cavities. An LED light bulb has a positive pin and a negative pin inserted inside the guiding channel, respectively, and being electrically connected to the wire sets. A light cap has a holding part passing the LED light bulb to tightly engage to the top of the light holder so as to fix the LED light bulb to the light holder.

Abstract: A method for surface activation on the metallization of electronic devices is provided. It uses plasma-immersion ion implantation and electroless plating to implant the seeds onto the diffusion barrier layer as catalyst for the electroless Cu plating to accomplish the ULSI interconnect metallization. It achieves electroless Cu plating in the deep 100 nm scaled line-width ULSI interconnect metallization by the Pd plasma implantation catalytic treatment. The method can fill the 100 nm line-width vias and trenches for gaining high quality electroless plated metal interconnects, and substitute for the traditional wet activation by SnCl2 and PdCl2 solution. For the plasma implanted seeds and electroless copper techniques, good Cu step coverage and gap-filling capability are observed in the trench and via metallization process with high adhesive strength. After thermal treatment, no obvious interfacial diffusion induced electric failure is found in the interface of the Cu/(implanted Pd)/TaN/FSG assembly.