Patents by Inventor Ueki Saruta

Ueki Saruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for encapsulating semiconductor
    Patent number: 4529755
    Abstract: An epoxy resin composition for encapsulating semiconductors and semiconductor elements is disclosed. This epoxy resin composition mainly comprises (a) a polyfunctional epoxy compound, (b) a styrene type block copolymer or styrene type block copolymer and liquid rubber, (c) a hardener for the epoxy compound and (d) an inorganic filler.
    Type: Grant
    Filed: October 21, 1983
    Date of Patent: July 16, 1985
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Nishikawa, Ueki Saruta, Shin-ichiro Asai