Abstract: The recognition and mounting apparatus including a zoom lens capable of changing imaging magnification, a chip camera, having a plurality of imaging pixels, capable of capturing an image an IC chip having a plurality of bumps arranged at at least one interval, through the zoom lens, a storage unit for storing shape information of the IC chip including at least information indicating an arrangement interval between the plurality of bumps, and a signal processor adjusting imaging magnification of the zoom lens based on a length of the imaging pixel and the information indicating the arrangement interval stored in the storage unit, and recognizing a position of the bump based on a plurality of pixel values in the image captured by the chip camera may be provided.

Abstract: An apparatus for recognizing an object may include a lens, a camera and a signal-processing unit. The lens may include two cross sections having different focal lengths. The camera may be configured to photograph the object having a first part through the lens. The first part may have a first shape. The signal-processing unit may be configured to recognize a height of the first part based on deviations of the first shape in an image obtained from the camera. Thus, the apparatus may only include the cylindrical lens interposed between the object and the camera except for the softwares for processing the signals. As a result, the apparatus may have a simple structure without a structure of a laser irradiation.

Abstract: In one embodiment the mounting apparatus mounts an upper chip on a lower chip, and thermally presses the upper chip with the lower chip. The mounting apparatus includes a first movement part for mounting the upper chip on the lower chip and preliminarily bonding by thermal pressing, and a second movement part for mainly bonding the plurality of upper chips preliminarily bonded with the plurality of lower chips for a longer time. The second movement part thermally presses the upper chips preliminarily bonded on the lower chip in a state that the upper chips are adsorbed on an adsorption surface parallel to a loading surface of the lower chip on which the upper chips are loaded.

Abstract: The recognition and mounting apparatus including a zoom lens capable of changing imaging magnification, a chip camera, having a plurality of imaging pixels, capable of capturing an image an IC chip having a plurality of bumps arranged at at least one interval, through the zoom lens, a storage unit for storing shape information of the IC chip including at least information indicating an arrangement interval between the plurality of bumps, and a signal processor adjusting imaging magnification of the zoom lens based on a length of the imaging pixel and the information indicating the arrangement interval stored in the storage unit, and recognizing a position of the bump based on a plurality of pixel values in the image captured by the chip camera may be provided.

Abstract: The confocal optical inspection apparatus that acquires a confocal image of an object and inspects the object includes a light source that emits illumination light; a first opening member that divides the illumination light emitted from the light source into illumination light beams, the first opening member having openings; an imaging device that acquires an image according to the respective illumination light beams reflected by the object; and an information processor that acquires a corrected confocal image in which distortion of an optical transmission path of the confocal optical inspection apparatus is removed from a time delayed integration (TDI) image obtained by a TDI operation of the imaging device, using a pre-measured point spread function (PSF) indicating optical characteristics of the confocal optical inspection apparatus.

Abstract: An auto focus control apparatus is provided to perform an auto focus adjustment using astigmatism without being affected by a pattern on a surface. A light receiving optical system includes an unpolarized beam splitter 420 separating a reflection light from an object into a first reflection light and a second reflection light, a first astigmatism producing means 430 arranged on an optical path of the first reflection light, a second astigmatism producing means 450 arranged on an optical path of the second reflection light, a first light detector 440 receiving a light passing through the first astigmatism producing means, and a second light detector 460 receiving a light passing through the second astigmatism producing means. The light source optical system 310 is arranged such that an image forming point of a focus error detecting light is defocused from an observation plane by a predetermined distance.

Abstract: In one embodiment the mounting apparatus mounts an upper chip on a lower chip, and thermally presses the upper chip with the lower chip. The mounting apparatus includes a first movement part for mounting the upper chip on the lower chip and preliminarily bonding by thermal pressing, and a second movement part for mainly bonding the plurality of upper chips preliminarily bonded with the plurality of lower chips for a longer time. The second movement part thermally presses the upper chips preliminarily bonded on the lower chip in a state that the upper chips are adsorbed on an adsorption surface parallel to a loading surface of the lower chip on which the upper chips are loaded.

Abstract: An apparatus for recognizing an object may include a lens, a camera and a signal-processing unit. The lens may include two cross sections having different focal lengths. The camera may be configured to photograph the object having a first part through the lens. The first part may have a first shape. The signal-processing unit may be configured to recognize a height of the first part based on deviations of the first shape in an image obtained from the camera. Thus, the apparatus may only include the cylindrical lens interposed between the object and the camera except for the softwares for processing the signals. As a result, the apparatus may have a simple structure without a structure of a laser irradiation.