Patents by Inventor Ugur Emekli

Ugur Emekli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for depositing copper on tungsten
    Patent number: 8377824
    Abstract: Apparatus and methods for depositing copper on tungsten are presented. The invention finds particular use in the semiconductor industry for depositing copper seed layers onto fields or through silicon vias having tungsten barrier layers, both reducing cost and complexity of existing methods.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: February 19, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan Reid, Sesha Varadarajan, Ugur Emekli
  • Methods and apparatus for depositing copper on tungsten
    Patent number: 8168540
    Abstract: Apparatus and methods for depositing copper on tungsten are presented. The invention finds particular use in the semiconductor industry for depositing copper seed layers onto fields or through silicon vias having tungsten barrier layers, both reducing cost and complexity of existing methods.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: May 1, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan Reid, Sesha Varadarajan, Ugur Emekli