Patents by Inventor Ui Kim

Ui Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11103408
    Abstract: Provided are an obstetric and gynecologic diagnosis apparatus and an obstetric and gynecologic diagnosis method using the same. The obstetric and gynecologic diagnosis apparatus includes a chair unit on which an object is mounted, the chair unit including an upper body support, a seat, and a leg cradle sequentially arranged in one direction and connected to each other; a storage configured to store body information of the object; an input interface configured to input identification (ID) information of the object; a controller configured to generate a control signal for moving at least one of the upper body support, the seat, and the leg cradle according to first body information of the object identified by the input ID information; and a driver configured to generate a driving force for moving at least one of the upper body support, the seat, and the leg cradle according to the control signal.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Sung-won Lim, Ui Kim, Jun-pil Moon, Cheon-seop Shin, Kil-su Ha
  • Publication number: 20180085271
    Abstract: Provided are an obstetric and gynecologic diagnosis apparatus and an obstetric and gynecologic diagnosis method using the same. The obstetric and gynecologic diagnosis apparatus includes a chair unit on which an object is mounted, the chair unit including an upper body support, a seat, and a leg cradle sequentially arranged in one direction and connected to each other; a storage configured to store body information of the object; an input interface configured to input identification (ID) information of the object; a controller configured to generate a control signal for moving at least one of the upper body support, the seat, and the leg cradle according to first body information of the object identified by the input ID information; and a driver configured to generate a driving force for moving at least one of the upper body support, the seat, and the leg cradle according to the control signal.
    Type: Application
    Filed: September 12, 2017
    Publication date: March 29, 2018
    Applicant: SAMSUNG MEDISON CO., LTD.
    Inventors: Sung-won LIM, Ui KIM, Jun-pil MOON, Cheon-seop SHIN, Kil-su HA
  • Patent number: 9868557
    Abstract: Disclosed herein is a cable packaging for medical devices that is provided with a perforated line and having heat shrinkage characteristic. With a capable packaging for medical devices to wrap around a cable that is configured to connect two or more apparatuses to each other, the cable packaging is formed of material that is shrunken by heat so as to come into close contact with the cable, and the cable packaging includes a perforated line so as to be separated from the cable. By forming the packaging using heat shrinkage material, a packaging volume is reduced, and by fixing the packaging so as to come into close contact with the cable, the durability of a connecting portion is improved.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: January 16, 2018
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Ui Kim, Jun Pil Moon
  • Publication number: 20140374308
    Abstract: Disclosed herein is a cable packaging for medical devices that is provided with a perforated line and having heat shrinkage characteristic. With a capable packaging for medical devices to wrap around a cable that is configured to connect two or more apparatuses to each other, the cable packaging is formed of material that is shrunken by heat so as to come into close contact with the cable, and the cable packaging includes a perforated line so as to be separated from the cable. By forming the packaging using heat shrinkage material, a packaging volume is reduced, and by fixing the packaging so as to come into close contact with the cable, the durability of a connecting portion is improved.
    Type: Application
    Filed: June 23, 2014
    Publication date: December 25, 2014
    Inventors: Ui KIM, Jun Pil MOON
  • Patent number: D703818
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: April 29, 2014
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Jun Pil Moon, Song Mi Ran, Ui Kim
  • Patent number: D703819
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: April 29, 2014
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Jun Pil Moon, Song Mi Ran, Ui Kim
  • Patent number: D703820
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: April 29, 2014
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Jun Pil Moon, Song Mi Ran, Ui Kim
  • Patent number: D703821
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: April 29, 2014
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Jun Pil Moon, Song Mi Ran, Ui Kim
  • Patent number: D703822
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: April 29, 2014
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Jun Pil Moon, Mi Ran Song, Ui Kim
  • Patent number: D705433
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: May 20, 2014
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Song Mi Ran, Ui Kim
  • Patent number: D713035
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: September 9, 2014
    Assignee: Samsung Medison Co., Ltd
    Inventors: Ui Kim, Mi Ran Song
  • Patent number: D767150
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: September 20, 2016
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Jun Pil Moon, Song Mi Ran, Ui Kim
  • Patent number: D791330
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: July 4, 2017
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Jun Pil Moon, Song Mi Ran, Ui Kim
  • Patent number: D804673
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: December 5, 2017
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Cheonseop Shin, Sungwon Lim, Ui Kim, Junpil Moon
  • Patent number: D809142
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: January 30, 2018
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Sungwon Lim, Cheonseop Shin, Junpil Moon, Ui Kim
  • Patent number: D825763
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: August 14, 2018
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Sungwon Lim, Cheonseop Shin, Junpil Moon, Ui Kim
  • Patent number: D875253
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: February 11, 2020
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Junpil Moon, Ui Kim, Cheonseop Shin, Sungwon Lim
  • Patent number: D876633
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: February 25, 2020
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Junpil Moon, Sungwon Lim, Kilsu Ha, Ui Kim
  • Patent number: D882799
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: April 28, 2020
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Junpil Moon, Sungwon Lim, Kilsu Ha, Ui Kim
  • Patent number: D884900
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Cheonseop Shin, Ui Kim, Junpil Moon, Sungwon Lim, Kilsu Ha