Abstract: A busbar unit electrically connected to a motor comprising a stator around which a coil is wound includes: a first terminal including a first body and a first terminal part protruding from an upper portion of the first body and electrically connected to the coil; a first holder configured to support the first terminal such that the first terminal part is exposed to an outside of the busbar unit; and a second holder disposed on an upper portion of the first holder and configured to press the coil against the first terminal part.

Abstract: The description relates to a semiconductor die having a stacking structure of silicon-metallic conductive layer-silicon, and the semiconductor die according to embodiments includes a stacking structure of first semiconductor layer-metallic conductive layer-second semiconductor layer, and first and second power semiconductor devices in the first semiconductor layer, in which the first power semiconductor device includes a first source bump and a first gate bump, first trench gate electrodes under the first source bump, and a first channel among the plurality of first trench gate electrodes, in which the second power semiconductor device includes a second source bump and a second gate bump, second trench gate electrodes under the second source bump, and a second channel among the plurality of second trench gate electrodes, and in which the metallic conductive layer includes a metal layer.