Abstract: A method of assembling an eddy current probe for use in nondestructive testing of a sample is described. The method includes positioning at least one substantially planar spiral drive coil within the eddy current probe, such that the drive coil is at least one of adjacent to and at least partially within a flexible material. The method further includes coupling at least one unpackaged solid-state magnetic field sensor to the at least one drive coil.

Abstract: A method of assembling an eddy current array probe to facilitate nondestructive testing of a sample is provided. The method includes positioning a plurality of differential side mount coils at least partially within a flexible material. The method also includes coupling the flexible material within a tip portion of the eddy current array probe, such that the flexible material has a contour that substantially conforms to a portion of a surface of the sample to be tested.

Abstract: A method of inspecting a component using an eddy current array probe (ECAP) is provided. The method includes scanning a surface of the component with the ECAP, collecting, with the ECAP, a plurality of partial defect responses, transferring the plurality of partial defect responses to a processor, modeling the plurality of partial defect responses as mathematical functions based on at least one of a configuration of elements of the ECAP and a resolution of the elements, and producing a single maximum defect response from the plurality of partial defect responses.

Abstract: A method for testing a component using an eddy current array probe is provided. The method includes calibrating the eddy current array probe, collecting data from the eddy current array probe for analysis, and processing the collected data to at least one of compensate for response variations due to a detected orientation of a detected imperfection and to facilitate minimizing noise.

Abstract: A method of assembling an eddy current array probe to facilitate nondestructive testing of a sample is provided. The method includes positioning a plurality of differential side mount coils at least partially within a flexible material. The method also includes coupling the flexible material within a tip portion of the eddy current array probe, such that the flexible material has a contour that substantially conforms to a portion of a surface of the sample to be tested.

Abstract: A method of assembling an eddy current probe for use in nondestructive testing of a sample is described. The method includes positioning at least one substantially planar spiral drive coil within the eddy current probe, such that the drive coil is at least one of adjacent to and at least partially within a flexible material. The method further includes coupling at least one unpackaged solid-state magnetic field sensor to the at least one drive coil.

Abstract: A non-planar part has a non-planar surface such as an edge, and may contain an anomaly such as a crack. The non-planar part is inspected using an eddy current technique. The method includes providing the non-planar part having the non-planar surface thereon, driving an eddy current probe at two or more frequencies, measuring an eddy current response signal of the non-planar part at each frequency, and performing a multifrequency phase analysis on the eddy current response signals.

Abstract: A method for inspecting a component having a surface profile that includes a local minima and a local maxima. The method includes generating a raw image of a component under test utilizing an eddy current inspection system, decomposing the raw image into a plurality of images wherein each image includes a different frequency component, and reconstructing at least one final image of the component that includes frequency components that are relevant to an eddy current flaw signal.

Abstract: A method for inspecting a part is provided. The method includes applying a number of multifrequency excitation signals to a probe to generate a number of multifrequency response signals for the part being inspected. The method further includes performing a multifrequency phase analysis on the multifrequency response signals to inspect a subsurface of the part. An inspection system is provided and includes an eddy current (EC) probe configured to induce eddy currents in a part. The system further includes an eddy current instrument coupled to the EC probe and configured to apply multifrequency excitation signals to the EC probe to generate multifrequency response signals. The system further includes a processor configured to analyze the multifrequency response signals from the EC instrument by performing a multifrequency phase analysis, to inspect a subsurface of the part.

Abstract: A method for generating a scanplan for inspection of a component is provided. The method includes loading a geometric model of the component and generating the scanplan of the component based on the geometric model and at least one scanning parameter. A method of inspecting a component is also provided and includes loading a geometric model of the component, generating a scanplan of the component based on the geometric model and at least one scanning parameter, mounting the component on an inspection system manipulator and inspecting the component including moving an inspection probe relative to the component using the scanplan.

Abstract: A method for inspecting a part is provided. The method includes applying a number of multifrequency excitation signals to a probe to generate a number of multifrequency response signals for the part being inspected. The method further includes performing a multifrequency phase analysis on the multifrequency response signals to inspect a subsurface of the part. An inspection system is provided and includes an eddy current (EC) probe configured to induce eddy currents in a part. The system further includes an eddy current instrument coupled to the EC probe and configured to apply multifrequency excitation signals to the EC probe to generate multifrequency response signals. The system further includes a processor configured to analyze the multifrequency response signals from the EC instrument by performing a multifrequency phase analysis, to inspect a subsurface of the part.

Abstract: A non-planar part has a non-planar surface such as an edge, and may contain an anomaly such as a crack. The non-planar part is inspected using an eddy current technique. The method includes providing the non-planar part having the non-planar surface thereon, driving an eddy current probe at two or more frequencies, measuring an eddy current response signal of the non-planar part at each frequency, and performing a multifrequency phase analysis on the eddy current response signals.

Abstract: An eddy current (EC) probe for inspecting a component is provided. The EC probe includes a tangential drive coil configured to generate a probing field for inducing eddy currents in the component, where a portion of the eddy currents are aligned parallel to an edge of the component. An axis of the tangential drive coil is aligned parallel to a surface of the component. The EC probe further includes a pair of sense coils, where an axis of the sense coils is aligned perpendicular to the surface of the component. The sense coils are configured to sense the portion of the eddy currents aligned parallel to the edge of the component.

Abstract: A method for inspecting a component having a surface profile that includes a local minima and a local maxima. The method includes positioning an eddy current probe proximate to a surface of the component to generate a first position indication, positioning the eddy current probe proximate to the surface of the component to generate a second position indication that is different than the first position indication, and interpolating between the first and second position indications to determine a profile of a portion of the surface of the component.

Abstract: A method for inspecting a component. The method includes generating a scan plan of a component to be inspected, coupling a side-mount probe to an eddy current inspection system, inducing an eddy current into the component, measuring the eddy current in the component to generate a plurality of scan data, and analyzing the scan data to generate at least one image of the component being inspected.