Patents by Inventor Uiseouk HWANG

Uiseouk HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220235252
    Abstract: The inorganic particle according to the present invention is composed of aggregation of crystalline and amorphous small particles and has a spherical and smooth surface. The spherical appearance, low crystallinity and narrow particle size distribution of inorganic particle are more advantageous in reducing scratch defects in the CMP process. In addition, since the small particles on the surface of the inorganic particle provide more active sites, the inorganic particle has an excellent removal rate, so it is advantageous as a next-generation CMP abrasive.
    Type: Application
    Filed: February 26, 2021
    Publication date: July 28, 2022
    Inventors: Jae-Do NAM, Na-Yeon KIM, In-Kyung PARK, Uiseouk HWANG, Donghak KIM