Abstract: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding.

Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.

Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.

Abstract: The present invention relates to a mobile communication terminal for Push To Talk (PTT) and a method for processing missed call information thereof, which allows a receiver to check why an originator requested the PTT telephone call during the absence of the receiver through missed call information. The missed call information includes the voice of the originator requesting the PTT call, and the voice of the originator is output when confirmation of the missed call information is requested.

Abstract: A method of fabricating a nitride semiconductor light emitting device is provided. The method includes growing a first group-III-nitride semiconductor layer on a substrate, the first group-III-nitride semiconductor layer having a top surface formed as a group-III-rich surface exhibiting a group-III-polarity and a bottom surface formed as a N-rich surface exhibiting a N-polarity. The method further includes selectively etching a N-polarity region in the top surface of the first group III nitride semiconductor layer, forming a second group III nitride semiconductor layer on the first group III nitride semiconductor layer to fill the etched N-polarity region and forming a light emitting structure including first and second conductivity type nitride semiconductor layers and an active layer on the second group III nitride semiconductor layer.

Abstract: There are provided a semiconductor light emitting device and a method of manufacturing the same. The semiconductor light emitting device includes a base layer configured of a group III nitride semiconductor, a polarity modifying layer formed on a group III element polar surface of the base layer, and a light emitting laminate having a multilayer structure of the group III nitride semiconductor formed on the polarity modifying layer, an upper surface of at least one layer in the multilayer structure being formed of an N polar surface.

Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.

Abstract: An image forming apparatus and an image quality calibration method in the image forming apparatus, the image forming apparatus including a printing unit to print a calibration chart in one mode selected from a plurality of resolution modes, a scanning unit to scan the printed calibration chart, and a calibrating unit to calibrate an image using color values of the scanned calibration chart according to the plurality of resolution modes.

Abstract: A semiconductor light emitting device includes first and second conductivity-type semiconductor layers formed of AlxGayIn1-x-yP (0?x?1, 0?y?1, 0?x+y?1) or AlzGa1-zAs (0?z?1) and an active layer interposed between the first and second conductivity-type semiconductor layers, wherein at least one of the first and second conductivity-type semiconductor layers includes a low refractive index surface layer formed of (AlvGa1-v)0.5In0.5P (0.7?v?1) or AlwIn1-wP (0?w?1) and having depressions and protrusions.

Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without performing a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.

Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Abstract: A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer.

Abstract: An embedded printed circuit board and a manufacturing method thereof are provided. The manufacturing method includes a first step of forming a first insulating layer having a seed layer formed on one side thereof and at least. one metal pattern embedded therein and a second step of laminating the first insulating layer and a base substrate with an inner circuit having a second insulating layer interposed between the first insulating layer and the base substrate. Accordingly, a printed circuit board with a circuit embedded in an insulating layer is provided, and thus a high-density and high-reliability printed circuit board can be achieved. Furthermore, since the printed circuit board is manufactured using a mold, a circuit manufacturing process for embedding, a process for forming a seed layer and a complicated process such as surface grinding are omitted so as to simplify the manufacturing process.

Abstract: An apparatus and a method for performing an attenuation function on a signal using an attenuator in a cable broadcast receiver having a Low Noise Amplifier (LNA) that does not perform an attenuation function on a signal are provided. In the method, an input Radio Frequency (RF) signal is tuned, The RF signal is converted into an Intermediate Frequency (IF) signal. An intensity of the converted IF signal is compared to a threshold, and an RF Automatic Gain Control (AGC) value is generated based on a result of the comparison. When the generated RF AGC value is smaller than an RF AGC threshold, the attenuator is turned on to attenuate the input RF signal by a predefined amount. Therefore, a high SNR, such as in an analog-digital composite signal, may be obtained without using an LNA that performs an attenuation function on a signal.

Abstract: A method for updating a firmware of a mobile terminal over the air in a mobile communication system and a mobile terminal using the same are provided comprising an internal memory and a detachable external memory and downloading an update file of a firmware from a firmware server over the air, in which size information of the update file is received, a download storage for storing the update file is selected in accordance with the size information, the update file is downloaded and stored in the selected download storage, and the firmware is updated with the stored update file. Accordingly, an update file can be selectively stored in an internal memory and an external memory in accordance with available storage capability using a firmware over-the air (FOTA) function.

Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.

Abstract: An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.

Abstract: The present invention relates to an isolated attenuated influenza virus strain and a live vaccine comprising the same. The isolated attenuated influenza virus strain is prepared by cold-adaptation of a mother strain which carries 6 internal genomes of A/PR/8/34(H1N1) and two surface antigens HA and NA of A/Aichi/2/68(H3N2). The attenuated influenza virus strain and the live vaccine of the present invention are useful for prevention of seasonal influenza episodes and sudden outbreak of influenza pandemics of predicted or unknown identity, since they have safety, efficacy, high production yield, immediate protection against variety of influenza subtypes and prolonged protection against specific influenza subtype.

Abstract: An image forming apparatus and an image quality calibration method in the image forming apparatus, the image forming apparatus including a printing unit to print a calibration chart in one mode selected from a plurality of resolution modes, a scanning unit to scan the printed calibration chart, and a calibrating unit to calibrate an image using color values of the scanned calibration chart according to the plurality of resolution modes.