Abstract: An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

Abstract: An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

Abstract: An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.

Abstract: An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.

Abstract: A method and structure polishes and cleans silicon wafers by mixing a marker with a slurry to form a slurry mixture, performs chemical mechanical polishing on a silicon wafer using the slurry mixture, rinses the slurry mixture from the silicon wafer, checks the silicon wafer for marker residue, and repeats the rinsing process if the checking process detects the marker residue on the wafer.

Abstract: A conditioning tool including a rotary conditioning pad; a lower shaft attached to the conditioning pad; an upper shaft having an upper end and a lower end, the lower end attached to the lower shaft via a flexible coupling; and a motor attached to the upper end of the upper shaft and adapted to rotate the shaft. The tool further includes a mechanism for measuring an angle of the conditioning pad relative to a reference plane. The conditioning tool may further include a conditioning arm, various control mechanisms, and a controller for receiving feedback from the angle measuring mechanism and the various control mechanisms and for controlling the various control mechanisms in response to the feedback. A chemical-mechanical polishing apparatus and a conditioning method for providing a uniform polishing surface of a chemical-mechanical polishing pad are also disclosed.

Abstract: A method of reconditioning a polishing pad using a chemical-mechanical polishing apparatus is disclosed, wherein the polishing pad contacts a workpiece in the presence of a slurry to perform chemical-mechanical polishing on the workpiece. The method comprises contacting the polishing pad with a reconditioning pad. The reconditioning pad is made of a polishing pad material similar to that of the polishing pad.

Abstract: A method and apparatus for cleaning polishing debris from the surface of a polishing pad by wetting the surface with a liquid and irradiating the wetted surface with a beam of light. The light beam has sufficient intensity at the polishing surface of the pad to vaporize at least a portion of the liquid such that the vaporized liquid causes at least a portion of the debris to be expelled from the polishing surface of the pad.

Abstract: A method and apparatus for treating the surface of a substrate includes generating ozone in a generation chamber by using an optical source and transporting the ozone to a treatment chamber containing the substrate. The surface treatment utilizes an optical energy source and the generated ozone. The generation chamber and the treatment chamber are initially isolated from one another, which allows for the selective regulation of delivering ozone from the generation chamber to the treatment chamber. Preferably, a single optical source both generates ozone in the generation chamber and serves to clean and/or planarize the surface in the treatment chamber.

Abstract: A desired design for electronic structures is converted into a graphic design format and sorted into a pseudo-raster format corresponding to scan lines. A laser or other machining beam is controlled by a separate tracking beam utilizing a mid-objective scanning system. The firing frequency of the machining beam is determined by the position of the tracking beam on a detector, as compared to the scan line data. Accuracy is verified by detection of plume or spectra generated during machining. Alignment of the machining and tracking beams is by interferometric methods. The system improves optical performance parameters of telecentricity, angle of scanned beam line, location of line in which the scanned line resides, astigmatism and field curvature.

Abstract: A desired design for electronic structures is converted into a graphic design format and sorted into a pseudo-raster format corresponding to scan lines. A laser or other machining beam is controlled by a separate tracking beam utilizing a mid-objective scanning system. The firing frequency of the machining beam is determined by the position of the tracking beam on a detector, as compared to the scan line data. Accuracy is verified by detection of plume or spectra generated during machining. Alignment of the machining and tracking beams is by interferometric methods. The system improves optical performance parameters of telecentricity, angle of scanned beam line, location of line in which the scanned line resides, astigmatism and field curvature.

Abstract: A desired design for electronic structures is converted into a graphic design format and sorted into a pseudo-raster format corresponding to scan lines. A laser or other machining beam is controlled by a separate tracking beam utilizing a mid-objective scanning system. The firing frequency of the machining beam is determined by the position of the tracking beam on a detector, as compared to the scan line data. Accuracy is verified by detection of plume or spectra generated during machining. Alignment of the machining and tracking beams is by interferometric methods. The system improves optical performance parameters of telecentricity, angle of scanned beam line, location of line in which the scanned line resides, astigmatism and field curvature.

Abstract: A desired design for electronic structures is converted into a graphic design format and sorted into a pseudo-raster format corresponding to scan lines. A laser or other machining beam is controlled by a separate tracking beam utilizing a mid-objective scanning system. The firing frequency of the machining beam is determined by the position of the tracking beam on a detector, as compared to the scan line data. Accuracy is verified by detection of plume or spectra generated during machining. Alignment of the machining and tracking beams is by interferometric methods. The system improves optical performance parameters of telecentricity, angle of scanned beam line, location of line in which the scanned line resides, astigmatism and field curvature.

Abstract: A laser system which utilizes a reflective objective lens includes a closed loop servo and beam profiling system to provide improved uniformity of the laser beam impinging on the work piece. The laser beam is passed through an aperture to pattern the work piece. A beamsplitter separates the laser beam into workpiece and diagnostic beams. The workpiece and diagnostic beams are both passed through identical reflective objective lenses, to accurately measures performance of the work piece beam. Preferably, a third reflective objective lens collimates the diagnostic beam and directs it to a beam analyzer where the uniformity can be accurately assessed. The information determined by the beam analyzer is then used to position a pre-aperture converging optic (PACO) located between the laser source and the aperture. Adjustments in the x- and y-dimensions of the PACO lens change the angular uniformity at the aperture.

Abstract: A train of air spaced optical mechanisms capable of taking a raw laser beam and focusing it on a workpiece for a range of cut sizes with varying magnifications and energy densities while controlling divergence and providing optimum uniformity. The lenses are diffraction limited for optimum uniformity and edge definition. The system uses variable down collimators to condense the beam to an aperture plane. The aperture is then imaged to the workpiece with Barlow, zoom transfer, collimator, and objective lenses. The components are color corrected to aid in alignment of an invisible beam and allow the aperture to be imaged to a workpiece in visible light.

Abstract: A desired design for electronic structures is converted into a graphic design format and sorted into a pseudo-raster format corresponding to scan lines. A laser or other machining beam is controlled by a separate tracking beam utilizing a mid-objective scanning system. The firing frequency of the machining beam is determined by the position of the tracking beam on a detector, as compared to the scan line data. Accuracy is verified by detection of plume or spectra generated during machining. Evaluation and alignment of the machining and tracking beams is by interferometric methods. The system improves optical performance parameters of telecentricity, angle of scanned beam line, location of line in which the scanned line resides, astigmatism and field curvature.

Abstract: A variable focus color corrected field lens for accepting rays having a divergence of from 0, wherein the rays are collimated, to a divergence of 10 milliradians full angle and directing the rays to the same point of an optical system. The present lens is corrected for wavelengths from the ultraviolet to the red spectrum of wavelengths for directing the wavelengths to the same point.

Abstract: An apparatus and method are disclosed for laser raster scanning a substrate in an XY plane wherein a single motor is used to provide synchronized X-Y scanning by two mirrors positioned orthogonally and which move linearly in an XY plane relative to each other by the rotation of the motor shaft. A preferred embodiment uses a specially designed cam to provide back and forth laser scanning motion and an intermittent gear to provide indexing of the laser. The apparatus and method may be configured for various scan speeds, spot sizes, Y-axis indexing and X-axis scan at the object plane. Over scanning of the active XY area of the object plane is preferred to provide constant velocity and energy density over the active XY area.

Abstract: A train of air spaced optical mechanisms capable of taking a raw laser beam and focusing it on a workpiece for a range of cut sizes with varying magnifications and energy densities while controlling divergence and providing optimum uniformity. The lenses are diffraction limited for optimum uniformity and edge definition. The system uses variable down collimators to condense the beam to an aperture plane. The aperture is then imaged to the workpiece with Barlow, zoom transfer, collimator, and objective lenses. The components are color corrected to aid in alignment of an invisible beam and allow the aperture to be imaged to a workpiece in visible light.

Abstract: A superachromatic focusing objective lens which focuses wavelengths extending between the ultraviolet and the visible wavelength spectrum and is able to achieve superachromatic correction for three wavelengths within the visible spectrum is disclosed. The present objective lens includes an achromatic lens to assist in the correction spherical and coma aberration, a modified gauss for minimizing spherochromatism, a reversed modified gauss for adding symmetry to aid in the correction of coma, distortion and lateral color aberrations, and a stop located between the modified gauss and the reverse modified gauss. A glass plate is provided for forming a splatter shield to protect the lens from debris, and may be used to define one wall of a vacuum chamber. The elements of the objective lens may be made from various glasses to include calcium fluoride, quartz, and barium fluoride.