Abstract: A cable attachment assembly, a hoist and a transportation system using the cable attachment assembly. The cable attachment assembly including: a plate pivotable about a first axis; first and second pivot assemblies pivotable about respective second and third axes, the first, second and third axes parallel to each other; a first cable retainer in the first pivot assembly, the first cable retainer adapted to rotateably retain an end of a first cable in the first cable pivot assembly, the first cable rotatable about a fourth axis; a second cable retainer in the second pivot assembly, the second cable retainer adapted to rotateably retain an end of a second cable in the second pivot assembly, the second cable rotatable about a fifth axis; wherein the fourth and fifth axes parallel to each other and the fourth and fifth axes are perpendicular to the first, second and third axis.

Abstract: A contour-adaptive particulate material collecting system and method of utilization thereof employed in a facility for the cleaning of an overhead support rail for overhead transport (OHT) vehicles, utilizing a cleaning apparatus which is coupled to an existing overhead transportation vehicle so as to be towed thereby, and wherein the apparatus removes foreign or contaminant materials (FM) from the overhead support rail, which is produced during operation of the facility and by normal wear from internal moving components of the OHT vehicle during operation of the latter.

Abstract: A steering apparatus and method is implemented that allows high speed, clean, particle-free transport of a semiconductor wafer or lithographic reticle on a transport vehicle at various positions on the vehicle track, especially when entering and exiting turns. Three computer-controlled electro-magnets are mounted at the left, center, and right side of a front steering truck, and are energized to attract strategically placed permanent magnet material mounted on a side of the track where the vehicle enters or exits a turn. The transport vehicle can be levitated by an air cushion or travel on wheels, and controlled by electromotive or electromagnetic forces about the track. Using the steering electro-magnets as a LVDT, a computer processor monitors the location of the transport vehicle about the track.

Abstract: Communication between a controller and a set of automated vehicles is improved by use of an RF link that employs a high frequency spread spectrum modem that establishes a low noise link in a high noise industrial environment and also shares the relevant frequency range with a wireless telephone system.

Abstract: Communication between a controller and a set of automated vehicles in a manufacturing facility is improved by use of a closed-loop control system that operates on a real-time interrupt basis in which autonomous carriers report their location, sensed from reference markers along a track, the reference markers being referenced to an absolute grid in space, to a central controller or to one of a set of zone controllers that monitor the location of nearby vehicles that ordinarily use a token-passing system to avoid collisions, but which controllers can intervene to prevent one vehicle from blocking or interfering with another.

Abstract: Communication between a controller and a set of automated vehicles is improved by use of an RF link that employs a high frequency spread spectrum modem that establishes a low noise link in a high noise industrial environment and also shares the relevant frequency range with a wireless telephone system.

Abstract: Exemplary embodiments of the invention include a method and system for providing dynamic verification and alignment of production tool loadports in an automated material handling system environment. The method includes transmitting light beams from a production tool loadport fixture to an overhead transport vehicle, reading values received from the light beams by a detector mounted on the overhead transport vehicle, calculating an offset value as a result of reading the values, and adding an identification for the production tool to a tool map. The method also includes adding the offset value for the production tool to the tool map and compensating for the offset values without taking the production tool offline by aligning the overhead transport vehicle with the production tool loadport fixture in accordance with the offset value.

Abstract: A hoisting method and device for use in an overhead traveling carriage system are disclosed. The hoisting device includes an engager for engaging an object and a linearly expandable structure coupling the engager to a base point. A single hoist member is coupled at a first end to the engager and at a second end to a motorized drum, coupled to the base point, for substantially vertically retracting and extending the single member. Since a single hoist member is used, the amount of precision machining and technician training are reduced. The linearly expandable structure includes at least one lazy-tong linkage or a telescoping structure, which provides sway stability and compactness. The invention may also include a six-degree adjustment structure that may include a feedback system for use with the linearly expandable structure to provide increased accuracy.

Abstract: A method, system and test fixture for allowing testing and calibration of various operation parameters of an overhead traveling vehicle (hereinafter “OTV”) are disclosed. The invention implements a test fixture that includes a rotatable bearing set for rotatably engaging a wheel of the OTV such that the wheel can rotate but the OTV remains stationary. The bearing set is held in a raised position, similar to the operational position of the OTV, by a raised support. The test fixture may also include a reflective tape for use with an optical sensor(s) of the OTV. In this fashion, operation parameters of the OTV such as drive servomotor velocity, current gain, current offset, OTV travel profile, optical sensor op-amp gain, etc., can be tested and calibrated.

Abstract: A method and structure polishes and cleans silicon wafers by mixing a marker with a slurry to form a slurry mixture, performs chemical mechanical polishing on a silicon wafer using the slurry mixture, rinses the slurry mixture from the silicon wafer, checks the silicon wafer for marker residue, and repeats the rinsing process if the checking process detects the marker residue on the wafer.

Abstract: An apparatus and method to align an invisible light beam sensor, such as an IR sensor, utilizing a visible light beam such as a visible LED or HeNe laser, and provide the ability to visually monitor when the sensor needs adjustment in real time and avoid off line adjustments. Various embodiments synchronize and position both the invisible light beam and the visible light beam to travel the same path to a common desired location.

Abstract: An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

Abstract: An apparatus and method to align an invisible light beam sensor, such as an IR sensor, utilizing a visible light beam such as a visible LED or HeNe laser, and provide the ability to visually monitor when the sensor needs adjustment in real time and avoid off line adjustments. Various embodiments synchronize and position both the invisible light beam and the visible light beam to travel the same path to a common desired location.

Abstract: An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

Abstract: An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

Abstract: An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.

Abstract: An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.

Abstract: A method and structure polishes and cleans silicon wafers by mixing a marker with a slurry to form a slurry mixture, performs chemical mechanical polishing on a silicon wafer using the slurry mixture, rinses the slurry mixture from the silicon wafer, checks the silicon wafer for marker residue, and repeats the rinsing process if the checking process detects the marker residue on the wafer.

Abstract: A conditioning tool including a rotary conditioning pad; a lower shaft attached to the conditioning pad; an upper shaft having an upper end and a lower end, the lower end attached to the lower shaft via a flexible coupling; and a motor attached to the upper end of the upper shaft and adapted to rotate the shaft. The tool further includes a mechanism for measuring an angle of the conditioning pad relative to a reference plane. The conditioning tool may further include a conditioning arm, various control mechanisms, and a controller for receiving feedback from the angle measuring mechanism and the various control mechanisms and for controlling the various control mechanisms in response to the feedback. A chemical-mechanical polishing apparatus and a conditioning method for providing a uniform polishing surface of a chemical-mechanical polishing pad are also disclosed.

Abstract: A method of reconditioning a polishing pad using a chemical-mechanical polishing apparatus is disclosed, wherein the polishing pad contacts a workpiece in the presence of a slurry to perform chemical-mechanical polishing on the workpiece. The method comprises contacting the polishing pad with a reconditioning pad. The reconditioning pad is made of a polishing pad material similar to that of the polishing pad.