Patents by Inventor ULF MUETER

ULF MUETER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811329
    Abstract: The present invention relates to a ceramic substrate (100) comprising: a front side (100-1), which comprises: i) a power semiconductor (102-1, . . . , 102-n); and ii) a first metallic layer (104) comprising at least one first metallic plane contact (104-1, . . . , 104-n), which is configured to connect the power semiconductor (102-1, . . . , 102-n) to a first terminal (105-1, . . . , 105-n) on an edge (100-3) of the ceramic substrate (100); a back side (100-2), which comprises: i) a capacitor (103) which is attached to a ii) second metallic layer (108) comprising at least one second metallic plane contact (108-1, . . . , 108-n), which is configured to connect the capacitor (103) to a second terminal (107-1, . . . , 107-n) on the edge (100-3) of the ceramic substrate (100); and a metallic frame (110), which is configured to connect the first metallic layer (104) to the second metallic layer (108).
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: October 20, 2020
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Peter Luerkens, Albert Garcia Tormo, Ulf Mueter
  • Publication number: 20180040528
    Abstract: The present invention relates to a ceramic substrate (100) comprising: a front side (100-1), which comprises: i) a power semiconductor (102-1, . . . , 102-n); and ii) a first metallic layer (104) comprising at least one first metallic plane contact (104-1, . . . , 104-n), which is configured to connect the power semiconductor (102-1, . . . , 102-n) to a first terminal (105-1, . . . , 105-n) on an edge (100-3) of the ceramic substrate (100); a back side (100-2), which comprises: i) a capacitor (103) which is attached to a ii) second metallic layer (108) comprising at least one second metallic plane contact (108-1, . . . , 108-n), which is configured to connect the capacitor (103) to a second terminal (107-1, . . . , 107-n) on the edge (100-3) of the ceramic substrate (100); and a metallic frame (110), which is configured to connect the first metallic layer (104) to the second metallic layer (108).
    Type: Application
    Filed: February 10, 2016
    Publication date: February 8, 2018
    Inventors: PETER LUERKENS, ALBERT GARCIA TORMO, ULF MUETER