Abstract: An automated circuit board assembly system includes at least one movable circuit board receiver that is equipped with an empty circuit board or a hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location.

Abstract: For gluing a circuit component (17) to a circuit board (1), at first at least one fore-running adhesive dot (14) is placed within a contact area (2) between the circuit component (17) and the circuit board (1), then adhesive dots (4) are placed in a regular pattern, and finally the adhesive dots (4) are brought to merge by pressing the circuit component (17) and the circuit board (1) against each other.

Abstract: A circuit component (1) is glued to the circuit substrate (2) by the following steps: a) seizing a circuit component (1) using a grip-per (4); b) moving the gripper (4) towards the surface of the circuit substrate (2) up to a target distance from the surface at which adhesive (3) applied between the circuit component (1) and the circuit substrate (2) is pressed; C) releasing the circuit component (1) and removing the gripper (4) from the circuit component (1); d) turning the gripper (4) around an axis (A) perpendicular to the surface of the circuit substrate (2); e) moving the gripper (4) into the target distance again; and f) removing the gripper (4) again.

Abstract: A method of gluing a circuit component onto a circuit board. The circuit component has a bottom area with at least one edge for bringing into contact with the circuit board. The distance between the edge and a first line parallel to the edge and an amount of adhesive to be applied per length unit along the line are determined such that, when placing the circuit component on the circuit board,the adhesive advances to the edge but not to a second circuit component adjacent to the edge. The adhesive is applied in the selected quantity along the first line and along further lines which are parallel to the first line and further away from the edge. Then, the circuit component is placed on the circuit board.

Abstract: In a procedure for automatically placing components of a circuit on a base plate based on predefined position data, the position of at least one first reference mark formed at the base plate is detected. A target position for placing a substrate on the base plate is calculated based on the detected position of the first reference mark and the position data, and the substrate is placed at the calculated position. The position of at least one second reference mark formed at the substrate is detected and a target position for placing a further component on the substrate is calculated based on the detected position of the second reference mark and the position data predefined for said component, and the component is placed at the calculated target position.

Abstract: Described is a plenum, in particular the air plenum of a gas-turbine combustion chamber, having at least two flow inlets, for introducing gas flows into the plenum, in which the gas flows are guided essentially along the inner wall of the plenum and are directed toward one another in such a way that the gas flows, after coinciding, are directed as a free gas flow away from the inner wall.The invention is distinguished by the fact that at least one flow obstacle (11) oriented in interaction with the direction of flow of the gas flows (1, 2) guided on the inner wall (3) is provided on the inner wall (3).