Patents by Inventor Ulhyoung LEE

Ulhyoung LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS FOR BUMP REFLOW AND METHODS OF FORMING BUMPS USING THE SAME
    Publication number: 20120031953
    Abstract: A method of forming wafer level bump includes forming at least one pre-bump on a first surface of a wafer, and performing a bump reflow process to the pre-bump while the first surface faces downward, such that a bump is formed.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 9, 2012
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Myeong Soon PARK, Taegyeong CHUNG, Eunchul AHN, Ulhyoung LEE, Sanghee LEE