Patents by Inventor Ulrich Albicker

Ulrich Albicker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8567256
    Abstract: A piezoresistive sensor chip element of a pressure sensor has lower face with an outer edge, an adhesion area and a non-adhesion area. The chip has a closed chip cavity for measuring the pressure of a medium flowing around the chip. The upper face of a substrate is fastened only at the adhesion area of the chip. The non-adhesion area extends at least over a circular area arranged centrally on the lower face and covers a third of the lower face's total area and extends over at least one connection area from the circular area to the edge of the lower face. The pressure in the pressure medium can spread through the connection area into a space under the non-adhesion area on the element lower face. The substrate has a recess located centrally under the sensor chip element.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: October 29, 2013
    Assignee: Kistler Holding, AG
    Inventors: Ulrich Albicker, Christof Sonderegger, Peter Meister, Jochen Von Berg, Rene Tanner, Jeffrey M. Schnellinger
  • Publication number: 20130167650
    Abstract: A piezoresistive sensor chip element of a pressure sensor has lower face with an outer edge, an adhesion area and a non-adhesion area. The chip has a closed chip cavity for measuring the pressure of a medium flowing around the chip. The upper face of a substrate is fastened only at the adhesion area of the chip. The non-adhesion area extends at least over a circular area arranged centrally on the lower face and covers a third of the lower face's total area and extends over at least one connection area from the circular area to the edge of the lower face. The pressure in the pressure medium can spread through the connection area into a space under the non-adhesion area on the element lower face. The substrate has a recess located centrally under the sensor chip element.
    Type: Application
    Filed: August 29, 2011
    Publication date: July 4, 2013
    Applicant: KISTLER HOLDING AG
    Inventors: Ulrich Albicker, Christof Sonderegger, Peter Meister, Jochen Von Berg, Rene Tanner, Jeffrey M. Schnellinger
  • Patent number: 7963154
    Abstract: A sensor unit for measuring a measurement variable in a medium, in particular in an aggressive liquid or gaseous medium, comprises a sensor that is arranged in a sensor capsule and has a sensor region that is arranged on a base body. In order to detect the measurement variable in the sensor region, a measurement opening is provided in the sensor capsule. On a side facing the measurement opening, the sensor region has a measurement surface that is provided with measurement electronics. An electrical supply line is provided on the sensor for the purpose of transmitting a sensor signal that is generated by the measurement electronics. A plated-through hole is provided in the base body. The plated-through hole is used to connect the measurement electronics to the electrical supply line via signals through the base body, on a base side of the sensor that faces away from the measurement opening.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: June 21, 2011
    Assignee: Kistler Holding AG
    Inventors: Ernst Obermeier, Biswajit Mukhopadhyay, Jochen Von Berg, Ulrich Albicker, Marco Gnielka, Claudio Cavalloni
  • Publication number: 20100018494
    Abstract: A sensor unit for measuring a measurement variable in a medium, in particular in an aggressive liquid or gaseous medium, comprises a sensor that is arranged in a sensor capsule and has a sensor region that is arranged on a base body. In order to detect the measurement variable in the sensor region, a measurement opening is provided in the sensor capsule. On a side facing the measurement opening, the sensor region has a measurement surface that is provided with measurement electronics. An electrical supply line is provided on the sensor for the purpose of transmitting a sensor signal that is generated by the measurement electronics. A plated-through hole is provided in the base body. The plated-through hole is used to connect the measurement electronics to the electrical supply line via signals through the base body, on a base side of the sensor that faces away from the measurement opening.
    Type: Application
    Filed: August 28, 2007
    Publication date: January 28, 2010
    Applicant: KISTLER HOLDING AG
    Inventors: Ernst Obermeier, Biswajit Mukhopadhyay, Jochen Von Berg, Ulrich Albicker, Marco Gnielka, Claudio Cavalloni