Abstract: A multi-beam generating unit of a multi-beam charged particle imaging system can exhibit reduced sensitivity to drift and extended lifetime. Drifts due to x-ray irradiation and thermal loads can be minimized by a combination of at least one of a shielding element, a cooling member, or an architecture and method for operating an active multi-aperture element. A lifetime can be improved by annealing methods of an active multi-aperture element or a microelectronic device forming for example a voltage supply unit.

Abstract: A multi-beam generation unit for a multi-beam system has larger individual focusing power for each of a plurality of primary charged particle beamlets. The multi-beam generation unit comprises an active terminating multi-aperture plate. The terminating multi-aperture plate can be used for a larger focusing range for an individual stigmatic focus spot adjustment of each beamlet of a plurality of primary charged particle beamlets.

Abstract: A multi-beam charged particle system and a method of setting a working distance WD of the multi beam charged particle system are provided. With the method, the working distance is adjusted while the imaging performance of a wafer inspection task is maintained by computing parameter values of components from predetermined calibration parameter values. The method can allow a relatively fast wafer inspection task even with a wafer stage with a fixed z-position parallel to an optical axis of the multi-beam charged particle system.

Abstract: A multi-beam charged particle inspection system and a method of operating a multi-beam charged particle inspection system for wafer inspection can provide high throughput with high resolution and high reliability. The method and the multi-beam charged particle beam inspection system can be configured to extract from a plurality of sensor data a set of control signals to control the multi-beam charged particle beam inspection system and thereby maintain the imaging specifications including a movement of a wafer stage during the wafer inspection task.

Abstract: Certain improvements of multi-beam raster units such as multi-beam generating units and multi-beam deflector units of a multi-beam charged particle microscopes are provided. The improvements include design, fabrication and adjustment of multi-beam raster units including apertures of specific shape and dimensions. The improvements can enable multi-beam generation and multi-beam deflection or stigmation with higher precision. The improvements can be relevant for routine applications of multi-beam charged particle microscopes, for example in semiconductor inspection and review, where high reliability and high reproducibility and low machine-to-machine deviations are desirable.

Abstract: An image sensor for a position sensor apparatus for ascertaining a position of at least one mirror of a lithography apparatus includes: a plurality of integrated optical waveguides; a plurality of incoupling areas; a multiplexer apparatus; and an image reconstruction apparatus.

Abstract: A multi-beam particle beam system includes a multi-aperture plate having a multiplicity of apertures. During operation, one particle beam of the plurality of particle beams passes through each of the apertures. A multiplicity of electrodes are insulated from the second multi-aperture plate to influence the particle beam passing through the aperture. A voltage supply system for the electrodes includes: a signal a generator to generate a serial sequence of digital signals; a D/A converter to convert the digital signals into a sequence of voltages between an output of the D/A converter and the multi-aperture plate; and a controllable changeover system, which feeds the sequence of voltages successively to different electrodes.

Abstract: A method of operating a multi-beam particle beam system includes: generating a multiplicity of particle beams such that they each pass through multipole elements that are either intact or defective; focusing the particle beams in a predetermined plane; determining excitations for the deflection elements of the multipole elements; exciting the deflection elements of the multipole elements that are intact with the determined excitations; modifying the determined excitations for the deflection elements of the multipole elements that are defective; and exciting the deflection elements of the defective multipole elements with the modified excitations. Modifying the determined excitations includes adding corrective excitations to the determined excitations. The corrective excitations are the same for all deflection elements of the defective multipole element.

Abstract: A multi-beam particle beam system includes a multi-aperture plate having a multiplicity of apertures. During operation, one particle beam of the plurality of particle beams passes through each of the apertures. A multiplicity of electrodes are insulated from the second multi-aperture plate to influence the particle beam passing through the aperture. A voltage supply system for the electrodes includes: a signal a generator to generate a serial sequence of digital signals; a D/A converter to convert the digital signals into a sequence of voltages between an output of the D/A converter and the multi-aperture plate; and a controllable changeover system, which feeds the sequence of voltages successively to different electrodes.

Abstract: A multi-beam particle beam system includes a multi-aperture plate having a multiplicity of apertures. During operation, one particle beam of the plurality of particle beams passes through each of the apertures. A multiplicity of electrodes are insulated from the second multi-aperture plate to influence the particle beam passing through the aperture. A voltage supply system for the electrodes includes: a signal a generator to generate a serial sequence of digital signals; a D/A converter to convert the digital signals into a sequence of voltages between an output of the D/A converter and the multi-aperture plate; and a controllable changeover system, which feeds the sequence of voltages successively to different electrodes.

Abstract: An image sensor for a position sensor apparatus for ascertaining a position of at least one mirror of a lithography apparatus includes: a plurality of integrated optical waveguides; a plurality of incoupling areas; a multiplexer apparatus; and an image reconstruction apparatus.

Abstract: An apparatus, for example a lithography apparatus or a multi-mirror system, includes comprises a radiation source for generating radiation, a plurality of optical components for guiding the radiation in the apparatus, a plurality of actuator/sensor devices for the optical components, and a drive device for driving the actuator/sensor devices.

Abstract: The disclosure provides a sensor arrangement for sensing a position of an optical element in a lithography system. The sensor arrangement includes: a first capacitive sensor device having a position-dependent variable first sensor capacitance that can be sensed using a first excitation signal; a second capacitive sensor device having a position-dependent variable second sensor capacitance that can be sensed using a second excitation signal; and a control device configured to produce the first and second excitation signals so that charges present on a parasitic capacitance associable with the first sensor device are at least partially compensated for by charges that are present on a parasitic capacitance associable with the second sensor device via a signal path outside the first and/or the second excitation signal path.

Abstract: An apparatus, for example a lithography apparatus or a multi-mirror system, includes comprises a radiation source for generating radiation, a plurality of optical components for guiding the radiation in the apparatus, a plurality of actuator/sensor devices for the optical components, and a drive device for driving the actuator/sensor devices.

Abstract: A multi-beam particle beam system includes a multi-aperture plate having a multiplicity of apertures. During operation, one particle beam of the plurality of particle beams passes through each of the apertures. A multiplicity of electrodes are insulated from the second multi-aperture plate to influence the particle beam passing through the aperture. A voltage supply system for the electrodes includes: a signal a generator to generate a serial sequence of digital signals; a D/A converter to convert the digital signals into a sequence of voltages between an output of the D/A converter and the multi-aperture plate; and a controllable changeover system, which feeds the sequence of voltages successively to different electrodes.

Abstract: A lithography apparatus includes a radiation source configured to produce radiation having a repetition frequency. The lithography apparatus also includes an optical component configured to guide the radiation within the lithography apparatus. The lithography apparatus further includes an actuator device configured to displace the optical component. In addition, the lithography apparatus includes a measurement device configured to determine a position of the optical component via a measurement signal having a measurement signal frequency. The measurement signal frequency is unequal to the repetition frequency, and the measurement signal frequency is unequal to integer multiples of the repetition frequency.

Abstract: A multi-mirror array including displaceable mirror elements includes a passive electric damping mechanism for damping disturbances of the displacement positions of the mirror elements.

Abstract: The disclosure provides a sensor arrangement for sensing a position of an optical element in a lithography system. The sensor arrangement includes: a first capacitive sensor device having a position-dependent variable first sensor capacitance that can be sensed using a first excitation signal; a second capacitive sensor device having a position-dependent variable second sensor capacitance that can be sensed using a second excitation signal; and a control device configured to produce the first and second excitation signals so that charges present on a parasitic capacitance associable with the first sensor device are at least partially compensated for by charges that are present on a parasitic capacitance associable with the second sensor device via a signal path outside the first and/or the second excitation signal path.

Abstract: A lithography apparatus includes a radiation source configured to produce radiation having a repetition frequency. The lithography apparatus also includes an optical component configured to guide the radiation within the lithography apparatus. The lithography apparatus further includes an actuator device configured to displace the optical component. In addition, the lithography apparatus includes a measurement device configured to determine a position of the optical component via a measurement signal having a measurement signal frequency. The measurement signal frequency is unequal to the repetition frequency, and the measurement signal frequency is unequal to integer multiples of the repetition frequency.

Abstract: A multi-mirror array including displaceable mirror elements includes a passive electric damping mechanism for damping disturbances of the displacement positions of the mirror elements.