Abstract: The invention relates to a method for producing an active optical connection with an optoelectronic element and a light deflection means for light deflection between the optoelectronic element and an optical waveguide arranged transversely with respect to the beam direction of said element. In this case, it is provided that a carrier substrate for the optoelectronic element is arranged in a highly precisely repeatably positioning machine, in particular a flip-chip machine, the optoelectronic element is mounted on the substrate by a or the highly precisely repeatably positioning machine and a curable, moldable compound is applied over the optoelectronic element, and the moldable compound is molded by a mold for molding light deflection means, said mold being moved by a or the highly precisely repeatably positioning machine, and at the earliest thereafter the substrate is removed from the or a highly precisely repeatably positioning machine.

Abstract: The invention relates to a method for producing an active optical connection with an optoelectronic element and a light deflection means for light deflection between the optoelectronic element and an optical waveguide arranged transversely with respect to the beam direction of said element. In this case, it is provided that a carrier substrate for the optoelectronic element is arranged in a highly precisely repeatably positioning machine, in particular a flip-chip machine, the optoelectronic element is mounted on the substrate by a or the highly precisely repeatably positioning machine and a curable, moldable compound is applied over the optoelectronic element, and the moldable compound is molded by a mold for molding light deflection means, said mold being moved by a or the highly precisely repeatably positioning machine, and at the earliest thereafter the substrate is removed from the or a highly precisely repeatably positioning machine.

Abstract: A method for establishing an optical connection between at least one optoelectronic component arranged in a first substrate and emitting or receiving optical radiation substantially perpendicular to a substrate surface of the first substrate, and at least one optical waveguide aligned with a first end substantially parallel to the substrate surface. The method comprises providing a second substrate that is transparent for at least one wavelength range of the optical radiation, and applying a layer of material on the second substrate. The layer is transparent, at least after structuring, for the wavelength range.

Abstract: A method for establishing an optical connection between at least one optoelectronic component arranged in a first substrate and emitting or receiving optical radiation substantially perpendicular to a substrate surface of the first substrate, and at least one optical waveguide aligned with a first end substantially parallel to the substrate surface. The method comprises providing a second substrate that is transparent for at least one wavelength range of the optical radiation, and applying a layer of material on the second substrate. The layer is transparent, at least after structuring, for the wavelength range.