Abstract: A printhead including a printhead substrate having at least one opening formed in a first surface to provide a fluid path through the substrate. The printhead further includes a thin film membrane formed on a second surface of the substrate. The thin film membrane includes a plurality of fluid ejection elements and has a floating section and a cantilevered section, which are detached and separated from one another by a gap.

Abstract: A printhead including a printhead substrate having at least one opening formed in a first surface to provide a fluid path through the substrate. The printhead further includes a thin film membrane formed on a second surface of the substrate. The thin film membrane includes a plurality of fluid ejection elements and has a floating section and a cantilevered section, which are detached and separated from one another by a gap.

Abstract: A high efficiency thermal inkjet printhead. The printhead includes a substrate, a base layer on the substrate, and at least one ink expulsion resistor on the base layer. The base layer is made from a special material that experiences a substantial increase in thermal conductivity at the elevated temperatures associated with resistor operation. As a result, the base layer functions as an effective thermal insulator when the resistors are initially energized, yet allows heat to dissipate from the resistors immediately after the deactivation thereof. Numerous benefits are achieved by this development including (1) rapid resistor cool-down between successive ink ejection cycles (which improves the speed/operational frequency of the system); and (2) the prevention of undesired heat dissipation through the base layer when the resistors are initially energized, with the generated heat instead flowing into the ink.

Abstract: A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum carbide layer disposed on the plurality of thin film layers, an ink barrier layer disposed over the tantalum carbide layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer. The tantalum carbide layer forms an oxidation and wear resistance layer and/or a barrier adhesion layer.