Patents by Inventor Ulrich Hausch

Ulrich Hausch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210403388
    Abstract: One aspect relates to a process for producing a sintered workpiece, which includes sintering of a ceramic material at a temperature of at least 1000° C. and in an atmosphere, in the case of which the partial pressure of atmospheric air is reduced to less than 10?6-times, based on the ambient air at the same temperature under equilibrium conditions.
    Type: Application
    Filed: June 14, 2021
    Publication date: December 30, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Leoni WILHELM, Ulrich HAUSCH, Robert DITTMER
  • Publication number: 20210360794
    Abstract: One aspect relates to a process for producing an electrical medical implant, comprising the following steps: a. providing an electrical feedthrough, which comprises a substrate, an electrical component, and a contact element; b. coating the electrical component with a layer.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 18, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventor: Ulrich HAUSCH
  • Patent number: 11110285
    Abstract: One aspect relates to an apparatus including a first frame, a further frame, a first element, a second element, and a third element. The first frame frames the further frame, the further frame frames the first element, and electrically insulates the first element and the first frame from each other. The first element is electrically conductive, the second element is electrically conductive, and the third element provides an electrically conductive connection between the first element and the second element, and has a porosity in the range of 0.001 to 0.4.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: September 7, 2021
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ulrich Hausch, Michael Schäfer, Jens Nachreiner
  • Publication number: 20210187831
    Abstract: One aspect relates to a method for manufacturing a medical electrode, including providing an electrically insulating substrate material, on which a conductor track is arranged; applying a continuous metal layer, which at least partially covers the substrate material, and the conductor track, so that an electrically conducting connection is formed between the metal layer and the conductor track; and partially removing the metal layer to form an electrode segment, which has an electrically conducting connection to the conductor track.
    Type: Application
    Filed: December 17, 2020
    Publication date: June 24, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Markus JUNG, Murad ABU ASAL, Ulrich HAUSCH
  • Patent number: 10881866
    Abstract: One aspect relates to an electrical contacting device for a medical implantable device, including an electrically insulating base body with a first and a second surface. The base body includes a ceramics, an electrically conductive conducting element that extends from the first surface of the base body through the base body. The conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection, a contact element including a metal. The contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure. The contacting device includes an adhesion element. The adhesion element is connected to the contact element in firmly bonded manner and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: January 5, 2021
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert Dittmer, Ulrich Hausch, Ilias Nikolaidis, Jens Trötzschel
  • Publication number: 20200291951
    Abstract: One embodiment relates to a pump device with an impeller; a pump housing, including a wall surrounding an interior having an inlet and an outlet. The impeller is provided in the interior of the pump housing. The pump housing includes at least one first part-region, at least two further part-regions and at least one third part-region. The at least one first part-region includes, to an extent of at least 60% by weight at least one nonmagnetic material. The at least two further part-regions comprise, to an extent of at least 25% by weight at least one ferromagnetic material metal. The at least one third part-region comprises a metal content in a range from 40% to 90% by weight. The at least two further part-regions of the pump housing at least partially project into the substantially tubular outer surface defined by the at least one first part-region.
    Type: Application
    Filed: April 13, 2020
    Publication date: September 17, 2020
    Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Stefan SCHIBLI, Jörg-Martin GEBERT, Ulrich HAUSCH, Oliver KEITEL
  • Patent number: 10770879
    Abstract: One aspect is a feedthrough for a medical implantable device including a ferrule having a metal that is configured to be welded to a case of the implantable device. The ferrule substantially surrounds an insulator and shares an interface therewith, the insulator having a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze or solder at the interface between the ferrule and the insulator and that there is no braze or solder adjacent the conductive elements.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: September 8, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch, Goran Pavlovic
  • Patent number: 10679778
    Abstract: One aspect relates to a component comprising i. a base body having a first component surface and a further component surface, the base body comprising a ceramic at least to an extent of 50 wt %, based on the total weight of the base body; ii. at least one electrical conduction element, the at least one electrical conduction element comprising a metal at least to an extent of 51 wt %, based on the electrical conduction element, and the at least one electrical conduction element passing through the entire base body from the first component surface to the further component surface; iii. at least one fastening element having a contact area, the at least one fastening element comprising a metal at least to an extent of 51 wt %, based on the fastening element, and the fastening element being surrounded at least in part by the base body.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: June 9, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens Troetzschel, Ulrich Hausch
  • Patent number: 10655631
    Abstract: One embodiment relates to a pump device with an impeller; a pump housing, including a wall surrounding an interior having an inlet and an outlet. The impeller is provided in the interior of the pump housing. The pump housing includes at least one first part-region, at least two further part-regions and at least one third part-region. The at least one first part-region includes, to an extent of at least 60% by weight, based on the total weight of the first part-region, at least one nonmagnetic material, wherein the at least two further part-regions comprise, to an extent of at least 25% by weight, based on the total weight of the further part-region, at least one ferromagnetic material metal, wherein the at least one third part-region comprises a metal content in a range from 40% to 90% by weight, based on the total weight of the third part-region.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: May 19, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Stefan Schibli, Jörg-Martin Gebert, Ulrich Hausch, Oliver Keitel
  • Patent number: 10617878
    Abstract: One aspect relates to a composite including a ceramic body, including a ceramic, a first surface, and a hole, including a front face, an end face and a lateral surface. The front face is an opening in the first surface. The ceramic body further includes a second surface and conductor a1. The conductor a1 electrically connects the second surface to the lateral surface, and includes a cermet.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: April 14, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jean-Francois Fischer, Ulrich Hausch, Jens Troetzschel
  • Patent number: 10514044
    Abstract: One aspect of the invention relates to a pump device, comprising i. an impeller; ii. a pump housing which at least partly surrounds an interior region, having an inlet and an outlet, wherein the impeller is located within the interior region of the pump housing; wherein the pump housing comprises at least one first subregion and at least one further subregion; wherein the first subregion comprises a ceramic, wherein the further subregion comprises a metal, wherein at least one part of the first subregion and at least one part of the further subregion are connected to one another. One aspect of the invention further relates to a housing which comprises the features described for the pump housing. One aspect of the invention also relates to a method for producing a pump housing.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: December 24, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Stefan Schibli, Ulrich Hausch
  • Publication number: 20190356122
    Abstract: One aspect is a feedthrough for a medical implantable device including a ferrule having a metal that is configured to be welded to a case of the implantable device. The ferrule substantially surrounds an insulator and shares an interface therewith, the insulator having a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze or solder at the interface between the ferrule and the insulator and that there is no braze or solder adjacent the conductive elements.
    Type: Application
    Filed: July 31, 2019
    Publication date: November 21, 2019
    Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Jacob Markham, Ulrich Hausch, Goran Pavlovic
  • Patent number: 10413639
    Abstract: One aspect relates to a composite, including a ceramic body having a first layer surface and a second layer surface and at least one cermet conductor that electrically connects the surfaces. The composite includes a first layer with the first layer surface, a first ceramic, a first hole and a first cermet element in the first hole, a second layer with the second layer surface, a second ceramic, a second hole and a second cermet element in the second hole, and an intermediate layer that is located between the first and the second layer. The intermediate layer includes an intermediate layer ceramic, an intermediate hole and one intermediate cermet element in the intermediate hole. A projection of the cross-section of the first hole and a projection of the cross section of the second hole onto a plane Px,y are arranged offset to each other.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: September 17, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert Dittmer, Ulrich Hausch, Jens Trötzschel, Peter Herzog, Josef Roth
  • Patent number: 10418798
    Abstract: One aspect is a feedthrough for a medical implantable device including a ferrule having a metal that is configured to be welded to a case of the implantable device. The ferrule substantially surrounds an insulator and shares an interface therewith, the insulator having a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze or solder at the interface between the ferrule and the insulator and that there is no braze or solder adjacent the conductive elements.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: September 17, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch, Goran Pavlovic
  • Publication number: 20190201699
    Abstract: One aspect relates to an electrical contacting device for a medical implantable device, including an electrically insulating base body with a first and a second surface. The base body includes a ceramics, an electrically conductive conducting element that extends from the first surface of the base body through the base body. The conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection, a contact element including a metal. The contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure. The contacting device includes an adhesion element. The adhesion element is connected to the contact element in firmly bonded manner and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 4, 2019
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert Dittmer, Ulrich Hausch, Ilias Nikolaidis, Jens Trötzschel
  • Patent number: 10286219
    Abstract: One aspect relates to an apparatus includes a ceramic body including a first surface and a further surface. The first surface is opposite the further surface, the first surface includes a first opening. The further surface includes a further opening. The first opening and the further opening are connected by a tunnel, which at least partly includes a tunnel filling and is occluded by the tunnel filling. The tunnel filling includes a first constituent, including a cermet, and a second constituent. The first and second constituents are electroconductingly connected to one another. The first constituent has a first electrical conductivity and the second constituent has a second electrical conductivity, which differs from the first by at least 5·10?4 Siemens per meter (S/m). The ceramic body is characterized by a further electrical conductivity. The first electrical conductivity is more by at least 1·105 Siemens per meter (S/m) than the 15 further electrical conductivity.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: May 14, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ilias Nikolaidis, Frederik Roth, Ulrich Hausch, Robert Dittmer, Jacqueline Gebhardt, Sandra Sauer
  • Publication number: 20190105431
    Abstract: One aspect relates to a composite, including a ceramic body having a first layer surface and a second layer surface and at least one cermet conductor that electrically connects the surfaces. The composite includes a first layer with the first layer surface, a first ceramic, a first hole and a first cermet element in the first hole, a second layer with the second layer surface, a second ceramic, a second hole and a second cermet element in the second hole, and an intermediate layer that is located between the first and the second layer. The intermediate layer includes an intermediate layer ceramic, an intermediate hole and one intermediate cermet element in the intermediate hole. A projection of the cross-section of the first hole and a projection of the cross section of the second hole onto a plane Px,y are arranged offset to each other.
    Type: Application
    Filed: October 4, 2018
    Publication date: April 11, 2019
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert DITTMER, Ulrich HAUSCH, Jens TRÖTZSCHEL, Peter HERZOG, Josef ROTH
  • Patent number: 10156256
    Abstract: A mechanical bearing contains a first component and a further component, wherein the mechanical bearing is designed such that the first component and the further component are able to execute a bearing movement relative to each other, wherein the first component or the further component contains a cermet or both contain a cermet. The invention further relates to an implantable medical device containing the mechanical bearing, in particular to a blood pump, and also to a use of a cermet for producing a mechanical bearing, and to a use of the mechanical bearing for supporting a component of an implantable medical device.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: December 18, 2018
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Jörg-Martin Gebert, Ulrich Hausch, Stefan Schibli
  • Publication number: 20180339149
    Abstract: One aspect relates to a multi-contact electrode, a method for manufacturing a multi-contact electrode, and a use of such multi-directional multi-contact electrode. The multi-contact electrode includes a support structure and a plurality of electrically conductive electrode segments. The support structure is made of a ceramic material. The electrode segments are made of a cermet material and are supported by the support structure. The electrode segments are distributed over an outer surface of the multi-contact electrode to form a multi-directional multi-contact electrode.
    Type: Application
    Filed: May 23, 2018
    Publication date: November 29, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert DITTMER, Ulrich HAUSCH, Jens TRÖTZSCHEL
  • Publication number: 20180318589
    Abstract: One aspect relates to a biocompatible composite system, an implantable medical device, and a manufacturing method for a biocompatible composite system. The biocompatible composite system includes a printed multi-layer circuit board and a feedthrough. The circuit board includes at least one electrically conductive via. The feedthrough includes an insulating ceramic base material and at least one electrically conductive cermet pathway. The pathway is embedded into the base material to form an electrically conductive and hermetically sealed connection to the via of the circuit board. The feedthrough and the circuit board are integrated into one composite part.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 8, 2018
    Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Quartz America LLC
    Inventors: Matthew Joseph DONELON, Robert DITTMER, Ulrich HAUSCH, Jens TROETZSCHEL