Abstract: Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said workpieces are machined in the polishing gap. A temperature control device being at least provided for the upper working disc by which a temperature control fluid can be conveyed through passages in the upper working disc. A spacing measuring device being associated with the working discs which measure the spacing in the polishing gap (gap width ?) at two radial spaced points of the polishing gap.

Abstract: Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said workpieces are machined in the polishing gap. A temperature control device being at least provided for the upper working disc by which a temperature control fluid can be conveyed through passages in the upper working disc. A spacing measuring device being associated with the working discs which measure the spacing in the polishing gap (gap width ?) at two radial spaced points of the polishing gap.

Abstract: Method for transporting, chemical-mechanical polishing and drying of workpieces, in particular silicon wafers in a sealed clean room with the following steps: the workpieces are removed by at least one transfer device from a loading and unloading station and transferred onto an intermediate station the workpieces are received by at least one polishing head of a polishing device of the intermediate station, transported to a polishing plate of the polishing device and held under rotation of the polishing head against the rotating polishing plate after polishing, the workpieces are transported back by the polishing head to the intermediate station, released from the polishing head and cleaned and/or chemically treated in the intermediate station the cleaned and/or chemically treated workpieces are transported from the intermediate station optionally to a second polishing device or to a washing or drying device and washed and dried therein the washed and dried workpieces are transported back by the transfer devic

Abstract: An apparatus for the chemical-mechanical polishing of surfaces of circular flat workpieces, in particular semi-conductor wafers, comprising a loading and unloading station for the workpieces which includes a carrier which is supported for rotation about a vertical axis and is driven by a rotary driving means into a predetermined rotary position, at least two horizontal loading surfaces on the carrier means facing upwardly. With a transfer means the workpieces can be placed on the loading surfaces or removed therefrom.

Abstract: An apparatus for the chemical-mechanical polishing of surfaces of circular flat workpieces, in particular semi-conductor wafers, comprising a loading and unloading station for the workpieces which includes a carrier which is supported for rotation about a vertical axis and is driven by a rotary driving means into a predetermined rotary position, at least two horizontal loading surfaces on the carrier means facing upwardly. With a transfer means the workpieces can be placed on the loading surfaces or removed therefrom.