Abstract: Microwaveable packages having highly conductive susceptors and methods for using same are provided. In a general embodiment, the microwaveable packages include a container defining an interior and having a microwave shielding material surrounding the interior. At least a portion of the microwave shielding material is a highly conductive susceptor. The highly conductive susceptor may include a standard microwave susceptor layer and a layer including a substrate having a source of mobile charges. Methods for increasing a surface heating of a food product are also provided and include, in a general embodiment, providing a food product in an interior of a container, which has a microwave shielding material surrounding the interior, and heating the food product in the container in a microwave oven for a predetermined amount of time.