Abstract: Method for manufacturing an absolute pressure sensor as micromechanical component on a silicon substrate, whereby a cavity (4) is etched out in an auxiliary layer (3) under a membrane layer (5) through etching openings (6), the etching openings are closed with a passivation layer (7), whereby a specific etching opening (11) is re-opened in a via hole etching and this opening is re-closed with a metallization or dielectric material (10, 12) in a following process step that ensues at low pressure.

Abstract: In a relative pressure sensor or miniaturized microphone as a micromechanical sensor component, a polysilicon membrane is arranged over a polysilicon membrane of an SOI substrate. A recess that is connected to the cavity between the membrane and the body silicon layer by openings in the body silicon layer is present in the substrate on the back side. Given an excursion of the membrane, a pressure equalization can therefore occur in the cavity as a result of these openings. The measurement occurs capacitatively by electrical connection of the electrically conductively doped membrane and a doped region formed in the body silicon layer.

Abstract: Rotation rate sensor as a micromechanical component in silicon, in which a ring with a rigid strut along a diameter is so suspended at elastic braces and anchoring arrangements on a substrate as to be able to perform rotation oscillations about its center axis and to be able to be tilted about the strut under the influence of outer torques. There are electrodes present at the ring and at the substrate, at which electrodes electrical voltages can be applied such that rotary oscillations of the ring about its center axis can be excited and rotary oscillations about the strut can be detected. To stabilize the position of the ring in the neutral position, additional electrodes can be provided at the ring and at the substrate for the generation of electrostatic forces.

Abstract: A semiconductor chip has a membrane mounted on supports that are held in the material of the chip so that the membrane is supported at a space from the chip. The membrane may be a metal layer. The supports are columns or webs that extend into the chip material. Electrical connections to the membrane may be made by conductive supports.