Abstract: In a vacuum treatment apparatus for deposition of thin layers on shell-shaped substrates (2, 2′, . . .

Abstract: A barrier discharge device (4a, 4b, 4c) installed in a vacuum chamber (1) consists essentially of at least two facing electrodes (20, 22); a dielectric (22) situated between the electrodes (20, 22) and in the immediate proximity of one of these electrodes (20); and a power source (26), which is connected electrically to the electrodes (20, 22). The plasma particles and UV radiation generated during the electrical discharge between the electrodes (20, 22) pass through the electrode (22), which is permeable to UV radiation and plasma particles, and thus emerge from the discharge space. On the surfaces (5a, 5b), the UV radiation induces a photochemical cleaning process, and the impinging plasma particles induce a plasma-chemical cleaning process. The cleaning process is essentially independent of pressure and can be used at pressures of up to 10 bars, which means that the cleaning process can be operated in particular during the time in which the vacuum chamber (1) is being pumped out.

Abstract: A vacuum coating apparatus has a pot-like tank (2) against whose open side a portion of a substrate (1) can be held sealingly. In the tank (2) there is disposed a target (7). A shut-off plate (9) makes it possible after lowering the substrate (1) to hold this target (7) under vacuum in a source chamber (11) protected against intrusion of air.

Abstract: The invention relates to a sputtering unit with an electrode (3) and a target (2) connected with this electrode (3) wherein this target (2) is interchangeable. Herein a consumed target (2) is replaced by a fresh and pre-sputtered target (7) thereby that the complete electrode (3) is replaced by a new electrode (6).

Abstract: Apparatus for coating substrates by a vacuum coating process. The apparatus includes a plurality of closed processing chambers, each provided with an entrance/exit closable opening. The individual processing chambers have an approximately equal configuration in groups and are disposed one above the other. The chambers have planes in each case at the same distance from a level on which the apparatus is set up. The individual chambers have entrance/exit closable openings. A common elevator chamber has a substrate lift by which the substrates can be moved vertically from the plane of one processing chamber to the plane of another processing chamber. The entrance/exit closable openings lead all to the common elevator chamber. At least one of the chambers of a group has an entrance/exit airlock chamber and is provided with an entrance/exit airlock opening which forms a connection to space surrounding the apparatus.

Abstract: A stationary magnetron sputtering cathode for vacuum coating systems for substrates 17 passing in front of the cathode 10 on a circular path K and disposed on a substrate holder 4 has a circular disk-like yoke plate 15, and a first group or row of magnets 14b, 14b'. . . , essentially forming a closed circular ring, is provided in the marginal zone of the yoke plate 15 and a second group or row of magnets 14a, 14a'. . . , forming a random but essentially symmetric configuration, is provided in the center of the yoke plate 15. The segment of the magnetic tunnel located in the half (III+IV) of the yoke plate 15 which faces away from the rotating shaft 5 of the substrate holder 4 has a greater total length than the tunnel segment provided on the half (I+II) of yoke plate 15 facing toward the rotating shaft 5.

Abstract: The invention relates to an apparatus for coating a substrate (1) with dielectrics which has a dc current source (10) connected to an electrode (5) which is connected to a target (3) which is being sputtered. The sputtered particles of the target (3) form a compound with an introduced substance which is deposited on the substrate (1). Permeating the target (3) are toroidal maganetic fields whose field lines emerge in the region of magnetic poles from the surface of the target (3). Under the invention an ac voltage source (30) is provided whose output voltage is superimposed on the dc voltage of the dc current source (10). Here, the electrical output of the ac current source (30) which is supplied to the electrode (5) corresponds to 5% to 25% of the output supplied by the dc current source (10) to the electrode (5).

Abstract: A cathodic system has a planar target for use in an atomizing apparatus for the sputtering of a dielectric or nonmagnetic coating onto a substrate. The cathodic system includes a magnetic field generator disposed on the side of the target opposite from that of the substrate and is constructed in the form of a planar coil which is disposed parallel to the target and has an area which corresponds substantially to the area of the target. The planar coil is insulated from the target and is cooled during use.