Abstract: A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Abstract: A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Abstract: A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted. In the method, a conductive foil is patterned in a first step to form the circuit trace structure. In a second operation, the circuit trace structure is equipped with the at least one electronic component. In a final operation, another foil is laminated onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component.

Abstract: A method for producing a photovoltaic module having backside-contacted semiconductor cells which have contact regions provided on a contact side includes: providing a foil-type, non-conducting substrate having an at least one-sided and at least sectionally electrically conductive substrate coating on a first substrate side; placing the contact sides of the semiconductor cells on a second substrate side; implementing a local perforation which penetrates the substrate and the substrate coating, to generate openings at the contact regions of the semiconductor cells; applying a contact element to fill the openings and to form a contact point between the substrate coating on the first substrate side and the semiconductor cells on the second substrate side.

Abstract: A method for producing a photovoltaic module having backside-contacted semiconductor cells which have contact regions provided on a contact side, the method including providing a non-conducting foil-type substrate, placing the contact sides of the semiconductor cells on the substrate, implementing laser drilling which penetrates the substrate to produce openings in the contact regions of the contact sides of the semiconductor cells, depositing a contacting means on the substrate to fill the openings and to form a contacting layer extending on the substrate.

Abstract: In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.

Abstract: A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted. In the method, a conductive foil is patterned in a first step to form the circuit trace structure. In a second operation, the circuit trace structure is equipped with the at least one electronic component. In a final operation, another foil is laminated onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component.

Abstract: A method for manufacturing an electronic assembly (27), including a circuit board (29) having at least one electronic component (9, 13), in which at least one electronic component (9) having contacting points (11) is initially fastened on a conductive film (1), the active side of the at least one electronic component (9) facing in the direction of the conductive film (1) and the contacting points (11) being positioned at contacting positions on the active side of the electronic component (9). The conductive film (1) having the at least one electronic component (9, 13) fastened thereto is then laminated onto a circuit board carrier (17), the at least one electronic component (9, 13) facing in the direction of the circuit board carrier (17). Finally, a printed conductor structure (25) is implemented by structuring the conductive film (1). Furthermore, the present invention relates to an electronic assembly.

Abstract: A device for determining one or multiple body functions of a person includes at least one body function sensor, an electronic unit, and a fixing arrangement for detachably fastening the device to the body of the person. The electronic unit includes a first film having a printed conductor structure, at least one electronic component situated on the first film and contacting the printed conductor structure, and a second film. To encapsulate the electronic component, the second film is laminated onto the side of the first film on which the electronic component is situated.

Abstract: In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.