Patents by Inventor Ulrich Schmergel

Ulrich Schmergel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROPLATING PROCESS AND COMPOSITION
    Publication number: 20060272951
    Abstract: A plating process employing an anode having a precious metal-based active material, and an electrolytic plating composition comprising a source of metal ions in an amount sufficient to electrolytically deposit a metal such as Cu onto the substrate, a source of chloride ions in an amount sufficient to provide at least 70 mg/L chloride ions into the composition, and a source of a d-block metal ions selected from the group consisting of molybdenum, vanadium, zirconium, tantalum, tungsten, hafnium, and titanium.
    Type: Application
    Filed: April 27, 2006
    Publication date: December 7, 2006
    Applicant: Enthone Inc.
    Inventors: Ulrich Schmergel, Jean Rasmussen
  • Process for the copper plating of substrates
    Patent number: 6576111
    Abstract: A process for the copper plating of substrates using insoluble anodes in acidic copper baths with separate replenishing of consumed copper ions, characterized in that the major portion of the copper ions is directly supplied in the form of copper carbonate and/or basic copper carbonate, dispensing with diaphragms and auxiliary electrolytes, in a separate tank operated in a bypass mode with respect to the working electrolyte, the released gaseous CO2 being separated off in said separate tank.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: June 10, 2003
    Assignee: Balsberg Oberflächentechnik GmbH
    Inventors: Jürgen Hupe, Walter Kronenberg, Eugen Breitkreuz, Ulrich Schmergel