Abstract: An easily automated and heat-stable semiconductor contacting system for linear and planar SMD components, particularly LED arrangements. SMD components are applied to a carrier film coated with interconnects. The interconnects are entirely or partly formed of solderable material for simpler contacting through melting.

Abstract: Manufacture of electrical components, particularly layer capacitors with dielectric layers of glow polymerisate, in which strip-shaped carriers are separated from an insulating tape. First, contact layers of a metal which does not soften during later contacting are applied to two opposite sides. Thereupon a metal layer and, optionally, further layers are applied to at least one side which is still free of metal. The metal layer is applied so that it overlaps at least one of the contact layers and forms with the latter an electrically conducting connection. The method is characterized by the features that the carriers are separated from an unmetallized insulating tape; that the cutting surfaces of the carriers are coated with the contact layers; and that then the metallization of the components is applied to one of the smooth surfaces which have not yet been metallized.

Abstract: An electrical capacitor in which metallized foils are loosely disposed one on top of the other and in which the dielectric layer is formed of materials which have desirable electrical properties but which are not particularly adapted to regeneration having a metallized surface which is insulated against the moisture by a liquid insulating oil. The insulating oil layer may consist of polyisobutylene or a silicone oil. A solvent is used to apply the oil and the solvent is given the opportunity to evaporate after the application.

Abstract: A layer or stack type capacitor having a covering foil, and adhesion-imparting layer disposed on the surface of the covering foil, a first electrically conductive layer disposed on the surface of the adhesion-imparting layer and a dielectric and second electrically conductive layer disposed respectively against the surface of the first electrode. The first conducting layer or electrode is made sufficiently thin so that the adhesion-imparting layer may adhere to the dielectric layer through pores of the first electrically conductive layer. The result is that the covering foil, adhesion-imparting layer, first electrically conductive layer and dielectric adhere together and are hermetically joined to eliminate the possibility of moisture entering into the vicinity of the first electrode to cause harmful corrosion.