Patents by Inventor Ulrich Wittreich

Ulrich Wittreich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11564310
    Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: January 24, 2023
    Assignee: Rolls-Royce Deutschland Ltd & Co KG
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Publication number: 20220400590
    Abstract: Various embodiments of the teachings herein include a device for detecting process parameters during a pass through an assembly line for assembling electronic components and/or for applying joining materials. The device may include: a carrier for transport by a conveying system of the assembly line and configured to receive a test plate; a sensor for measuring a process parameter during the pass; and a force sensor arranged to detect a force acting on the test plate during the pass.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 15, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: Michael Hanisch, Jonas Massierer, Marco Matiwe, Dennis Sommerfeld, Ulrich Wittreich, Kay Jarchoff, Jörg Schubert, Dirk Wormuth
  • Publication number: 20220333961
    Abstract: Various embodiments of the teachings herein include a sensor element for recording process parameters at a measurement point in a sintering press/sintering plant. The sensor element comprises: a first temperature sensor; and a force sensor. A force and a temperature are recorded at the measurement point at which the sensor element is arranged.
    Type: Application
    Filed: June 26, 2020
    Publication date: October 20, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: Michael Hanisch, Nora Jeske, Jonas Massierer, Marco Matiwe, Dennis Sommerfeld, Ulrich Wittreich
  • Publication number: 20210161002
    Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).
    Type: Application
    Filed: March 20, 2019
    Publication date: May 27, 2021
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Publication number: 20210021179
    Abstract: A circuit arrangement is disclosed herein. The circuit arrangement includes a circuit carrier board, a power semiconductor arranged on the underside of the circuit carrier board, and a wiring carrier board arranged underneath the power semiconductor. The circuit arrangement further includes a metallic first spacer element arranged between the circuit carrier board and the wiring carrier board and via which an electric load current from the power semiconductor flows, wherein the first spacer element acts as a shunt through which current flows. The circuit arrangement further includes a voltage measuring unit, by which a voltage drop across the first spacer element, produced by the load current flow, may be determined. A converter having such a circuit arrangement, an aircraft having a converter, and a method for current measurement in power semiconductors are likewise specified.
    Type: Application
    Filed: February 28, 2019
    Publication date: January 21, 2021
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Patent number: 10582642
    Abstract: Examples include cooling members for electronic components and/or methods for producing cooling members. The members may include: an assembly side for an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels. The cooling channels may have a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: March 3, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Michael Niedermayer, Ulrich Wittreich, Manfred Zäske
  • Patent number: 10426025
    Abstract: The present disclosure relates manufacturing for electronic circuit in a production installation. The teachings thereof may be embodied in a method for manufacturing an electronic circuit in a production installation comprising: detachably connecting a circuit carrier to a measuring module before performance of a process step; performing a measurement with the measuring module during the performance of the process step; and removing the measuring module from the circuit carrier after termination of the process step.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: September 24, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Bernd Mueller, Michael Niedermayer, Ulrich Wittreich
  • Publication number: 20180269371
    Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.
    Type: Application
    Filed: September 7, 2016
    Publication date: September 20, 2018
    Applicant: Siemens Aktiengesellschaft
    Inventors: Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Michael Niedermayer, Ulrich Wittreich, Manfred Zäske
  • Publication number: 20180235101
    Abstract: The present disclosure relates to electronics. The teachings thereof may be embodied in cooling members for electronic components and/or methods for producing cooling members with an assembly side for an electronic component. For example, a cooling member may include: an assembly side for mounting an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels with a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.
    Type: Application
    Filed: July 8, 2016
    Publication date: August 16, 2018
    Applicant: Siemens Aktiengesellschaft
    Inventors: Martin FRANKE, Peter FRÜHAUF, Rüdiger KNOFE, Bernd MÜLLER, Stefan NERRETER, Michael NIEDERMAYER, Ulrich WITTREICH, Manfred ZÄSKE
  • Patent number: 9986648
    Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: May 29, 2018
    Assignees: SIEMENS AKTIENGESELLSCHAFT, KLEB-UND GIESSHARZTECHNIK DR. LUDECK GMBH
    Inventors: Michael Hanisch, Heiko Huth, Wolfgang Ludeck, Bernd Mueller, Mathias Nowottnick, Andrey Prihodovsky, Dirk Seehase, Ulrich Wittreich, Dirk Wormuth
  • Publication number: 20180110131
    Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
    Type: Application
    Filed: March 29, 2016
    Publication date: April 19, 2018
    Applicants: Siemens Aktiengesellschaft, Kleb- und Giessharztechnik Dr. Ludeck GmbH
    Inventors: Michael Hanisch, Heiko Huth, Wolfgang Ludeck, Bernd Mueller, Mathias Nowottnick, Andrey Prihodovsky, Dirk Seehase, Ulrich Wittreich, Dirk Wormuth
  • Patent number: 9498836
    Abstract: A carrier plate has test areas for the assessment of a selective soldering process. The carrier plate has different zones, which are provided with peripheral borders. The zones are not wettable with solder, while the peripheral borders are wettable. If a selective soldering head is brought up to the reference areas, then, as long as there is no deficiency in quality, the respective peripheral border must be just wetted with solder, whereby an assessment of the selective soldering process is possible. The test plate advantageously makes a simple optical evaluation possible, for example by visual inspection.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: November 22, 2016
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Bernd Müller, Ulrich Wittreich
  • Publication number: 20140284374
    Abstract: A carrier plate has test areas for the assessment of a selective soldering process. The carrier plate has different zones, which are provided with peripheral borders. The zones are not wettable with solder, while the peripheral borders are wettable. if a selective soldering head is brought up to the reference areas, then, as long as there is no deficiency in quality, the respective peripheral border must be just wetted with solder, whereby an assessment of the selective soldering process is possible. The test plate advantageously makes a simple optical evaluation possible, for example by visual inspection.
    Type: Application
    Filed: June 22, 2012
    Publication date: September 25, 2014
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Bernd Müller, Ulrich Wittreich
  • Publication number: 20110162871
    Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.
    Type: Application
    Filed: June 26, 2009
    Publication date: July 7, 2011
    Applicant: W.C. HERAEUS GMBH
    Inventors: Rolf Diehm, Wolfgang Ludeck, Andrey Prihodovsky, Wolfgang Schmitt, Hubert Trageser, Andreas Fix, Matthias Hutter, Uwe Pape, Patrick Zerrer, Hartmut Meier, Bernd Müller, Ulrich Wittreich, Dirk Wormuth
  • Patent number: 7753997
    Abstract: The present invention is directed to a cleaning device for process gases of a reflow soldering system that includes a plurality of cleaning chambers. The plurality of cleaning chambers contain a cleaning liquid for the process gas, where each of the cleaning chambers is adapted to be flown through via a supply line for the contaminated process gas and via a discharge line for the cleaned gas. The cleaning chambers also include a plurality of cleaning walls along which the cleaning liquid is flown for take-up of impurities in the process gas into the cleaning liquid. A plurality of the deposition walls is provided, where at least one of the deposition walls also forms an outer wall of the cleaning device.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: July 13, 2010
    Assignee: Rehm Thermal Systems GmbH
    Inventors: Hartmut Meier, Bernd Müller, Ulrich Wittreich