Patents by Inventor Ulrik Riis Madsen
Ulrik Riis Madsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11349217Abstract: Methods and devices for integrating antennas fabricated using planar laminate processes. The method includes laminating one or more conductive layers to a first dielectric material layer, forming one or more holes through at least the first dielectric material layer, forming a monopole antenna through at least a first of the holes, attaching one or more integrated circuit dies to one of the conductive layer, and connecting the integrated circuit dies to the monopole antenna. The device can include a planar laminate integrated circuit module including one or more dielectric material layers, one or more integrated circuit die on a surface of or attached to the planar laminate integrated circuit module, and an integrated monopole antenna interfaced with the integrated circuit dies. The integrated monopole antenna is formed in a through hole of the planar laminate integrated circuit module, the through hole being formed through at least one of the dielectric material layers.Type: GrantFiled: January 24, 2020Date of Patent: May 31, 2022Assignee: WISPRY, INC.Inventors: Jørgen Bøjer, Mikkel Baumann-Jorgensen, Brian Skjold Bertelsen, Ulrik Riis Madsen, Mathias Zacho Vestergaard, Arthur S. Morris, III
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Publication number: 20200243958Abstract: Methods and devices for integrating antennas fabricated using planar laminate processes. The method includes laminating one or more conductive layers to a first dielectric material layer, forming one or more holes through at least the first dielectric material layer, forming a monopole antenna through at least a first of the holes, attaching one or more integrated circuit dies to one of the conductive layer, and connecting the integrated circuit dies to the monopole antenna. The device can include a planar laminate integrated circuit module including one or more dielectric material layers, one or more integrated circuit die on a surface of or attached to the planar laminate integrated circuit module, and an integrated monopole antenna interfaced with the integrated circuit dies. The integrated monopole antenna is formed in a through hole of the planar laminate integrated circuit module, the through hole being formed through at least one of the dielectric material layers.Type: ApplicationFiled: January 24, 2020Publication date: July 30, 2020Inventors: Jørgen Bøjer, Mikkel Baumann-Jorgensen, Brian Skjold Bertelsen, Ulrik Riis Madsen, Mathias Zacho Vestergaard, Arthur S. Morris, III
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Publication number: 20200244327Abstract: The present subject matter relates to systems, devices, and methods for controlling the directional gain of an antenna. in some embodiments, an antenna for wireless communications includes a monopole antenna element and at least one passive beam-steering element that is spaced apart from the monopole antenna element. The at least one passive beam-steering element is configured to steer a signal beam from the monopole antenna element in a direction substantially orthogonal to the monopole antenna element.Type: ApplicationFiled: January 24, 2020Publication date: July 30, 2020Inventors: Jørgen Bøjer, Mikkel Baumann-Jorgensen, Brian Skjold Bertelsen, Ulrik Riis Madsen, Mathias Zacho Vestergaard, Arthur S. Morris, III
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Patent number: 9942994Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.Type: GrantFiled: June 25, 2015Date of Patent: April 10, 2018Assignee: Qorvo US, Inc.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Donald Joseph Leahy
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Patent number: 9420704Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.Type: GrantFiled: July 31, 2014Date of Patent: August 16, 2016Assignee: Qorvo US, Inc.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Donald Joseph Leahy
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Publication number: 20150296631Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.Type: ApplicationFiled: June 25, 2015Publication date: October 15, 2015Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Donald Joseph Leahy
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Patent number: 9137934Abstract: Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.Type: GrantFiled: July 25, 2011Date of Patent: September 15, 2015Assignee: RF Micro Devices, Inc.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Brian D. Sawyer, Milind Shah, John Robert Siomkos, Mark Alan Crandall, Dan Carey
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Publication number: 20140340859Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.Type: ApplicationFiled: July 31, 2014Publication date: November 20, 2014Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Donald Joseph Leahy
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Patent number: 8835226Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.Type: GrantFiled: February 25, 2011Date of Patent: September 16, 2014Assignee: RF Micro Devices, Inc.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Donald Joseph Leahy
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Patent number: 8614899Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: March 8, 2012Date of Patent: December 24, 2013Assignee: RF Micro Devices, Inc.Inventors: Ulrik Riis Madsen, Lars Sandahl Ubbesen
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Patent number: 8296941Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: May 27, 2011Date of Patent: October 30, 2012Assignee: RF Micro Devices, Inc.Inventors: David J. Hiner, Waite R. Warren, Jr., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20120217624Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.Type: ApplicationFiled: February 25, 2011Publication date: August 30, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Donald Joseph Leahy
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Publication number: 20120170239Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: March 8, 2012Publication date: July 5, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Ulrik Riis Madsen, Lars Sandahl Ubbesen
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Publication number: 20120044653Abstract: Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.Type: ApplicationFiled: July 25, 2011Publication date: February 23, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Brian D. Sawyer, Milind Shah, John Robert Siomkos, Mark Alan Crandall, Dan Carey
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Publication number: 20110225803Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: May 27, 2011Publication date: September 22, 2011Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20100199492Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: April 23, 2010Publication date: August 12, 2010Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20090002969Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: Ulrik Riis Madsen, Lars Sandahl Ubbesen
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Publication number: 20090000815Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Patent number: 7340235Abstract: A system and method for limiting current in an output stage of power amplifier circuitry in a transmitter of a mobile terminal are provided. In general, the current in the output stage of the power amplifier circuitry is detected during each transmit burst from the power amplifier circuitry. For each transmit burst, an error correction value for a corresponding power level is determined based on the detected current and a predetermined threshold value. The error correction value is used to correct an adjustable power control signal that controls the power level of the power amplifier circuit for a subsequent transmit burst at the same power level.Type: GrantFiled: February 3, 2005Date of Patent: March 4, 2008Assignee: RF Micro Devices, Inc.Inventors: Ulrik Riis Madsen, Darrell G. Epperson
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Patent number: 7315152Abstract: A system for detecting current in an output stage of power amplifier circuitry in a transmitter of a mobile terminal is provided. In general, the mobile terminal includes power amplifier circuitry, power control circuitry, current detection circuitry, and an inductor that essentially prevents radio frequency coupling between the power control circuitry and the power amplifier circuitry. Based on a voltage across the inductor, the current detection circuitry generates a voltage detection signal indicative of a current in the inductor and thus the current in an output stage of the power amplifier.Type: GrantFiled: February 3, 2005Date of Patent: January 1, 2008Assignee: RF Micro Devices, Inc.Inventors: Darrell G. Epperson, Ulrik Riis Madsen