Abstract: A substrate processing apparatus having a station for loading and unloading substrates from the apparatus, includes an aperture closure for sealing a loading and unloading aperture of the station, a fluidic magazine door drive for removing a door of a substrate magazine and thus opening the substrate magazine and for operating the aperture closure to open the aperture, and sensor for mapping vertical locations of substrates mounted to the magazine door of the drive. The fluidic magazine door drive may include an encoder different from the sensor, the encoder being configured for determining the vertical location of the sensor.

Abstract: In accordance to an exemplary embodiment of the disclosed embodiments, a substrate aligner apparatus is presented, the substrate aligner apparatus having a frame adapted to allow a substrate transporter to transport a substrate to and from the aligner apparatus, an inverted chuck capable of holding the substrate and movably connected to the frame by a chuck driveshaft engaged to the inverted chuck for moving the inverted chuck relative to the frame and effecting alignment of the substrate, a sensing device located between the chuck and chuck driveshaft for detecting a position determining feature of the substrate, and a substrate transfer mechanism movably connected to the frame and located inside the frame below the inverted chuck for moving the substrate from the inverted chuck to the substrate transporter.

Abstract: A substrate transport apparatus having a drive section and a scara arm operably connected to the drive section to move the scara arm. The scara arm has an upper arm and at least one forearm. The forearm is movably mounted to the upper arm and capable of holding a substrate thereon. The upper arm is substantially rigid and is adjustable for changing a predetermined dimension of the upper arm.

Abstract: A semiconductor workpiece processing system having at least one processing apparatus for processing workpieces, a primary transport system, a secondary transport system and one or more interfaces between first transport system and second transport system. The primary and secondary transport systems each have one or more sections of substantially constant velocity and in queue sections communicating with the constant velocity sections.

Abstract: A drive section for a substrate transport arm including a frame, at least one stator mounted within the frame, the stator including a first motor section and at least one stator bearing section and a coaxial spindle magnetically supported substantially without contact by the at least one stator bearing section, where each drive shaft of the coaxial spindle includes a rotor, the rotor including a second motor section and at least one rotor bearing section configured to interface with the at least one stator bearing section, wherein the first motor section is configured to interface with the second motor section to effect rotation of the spindle about a predetermined axis and the at least one stator bearing section is configured to effect at least leveling of a substrate transport arm end effector connected to the coaxial spindle through an interaction with the at least one rotor bearing section.

Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

Abstract: A semiconductor workpiece processing system having at least one processing apparatus for processing workpieces, a primary transport system, a secondary transport system and one or more interfaces between first transport system and second transport system. The primary and secondary transport systems each have one or more sections of substantially constant velocity and in queue sections communicating with the constant velocity sections.

Abstract: A substrate processing apparatus including a frame, a first SCARA arm connected to the frame, including an end effector, configured to extend and retract along a first radial axis; a second SCARA arm connected to the frame, including an end effector, configured to extend and retract along a second radial axis, the SCARA arms having a common shoulder axis of rotation; and a drive section coupled to the SCARA arms is configured to independently extend each SCARA arm along a respective radial axis and rotate each SCARA arm about the common shoulder axis of rotation where the first radial axis is angled relative to the second radial axis and the end effector of a respective arm is aligned with a respective radial axis, wherein each end effector is configured to hold at least one substrate and the end effectors are located on a common transfer plane.

Abstract: A robotic transport apparatus including a drive system including at least one harmonic motor assembly, at least one drive shaft coupled to the at least one harmonic motor assembly, at least one robotic arm mounted to the at least one drive shaft, where the robotic arm is located inside a sealed environment, and at least one atmospheric isolation seal seated on an output surface of the drive system and forming an atmospheric barrier disposed so that the at least one drive shaft extends through the atmospheric barrier into the sealed environment and the at least one harmonic motor assembly is located outside the sealed environment, wherein the robotic transport apparatus is a high capacity payload transport apparatus.

Abstract: In accordance to an exemplary embodiment of the disclosed embodiments, a substrate aligner apparatus is presented, the substrate aligner apparatus having a frame adapted to allow a substrate transporter to transport a substrate to and from the aligner apparatus, an inverted chuck capable of holding the substrate and movably connected to the frame by a chuck driveshaft engaged to the inverted chuck for moving the inverted chuck relative to the frame and effecting alignment of the substrate, a sensing device located between the chuck and chuck driveshaft for detecting a position determining feature of the substrate, and a substrate transfer mechanism movably connected to the frame and located inside the frame below the inverted chuck for moving the substrate from the inverted chuck to the substrate transporter.

Abstract: A substrate transport apparatus including a drive section having at least one drive shaft and at least two scara arms operably coupled to the at least one drive shaft, the at least one drive shaft being a common drive shaft for the at least two scara arms effecting extension and retraction of the at least two scara arms, wherein the at least two scara arms are coupled to each other so that, with the at least one drive shaft coupled to the at least two scara arms, rotation of the drive shaft effects extension and retraction of one of the at least two scara arms substantially independent of motion of another of the at least two scara arms.

Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier so the at least one substrate transport carrier is capable of being coupled to the load port interface without lifting the at least one substrate transport carrier off the carrier holding station. The carrier holding station is arranged to provide a substantially simultaneous swap section for substantially simultaneous replacement of the substrate transport carrier from the carrier holding station.

Abstract: A substrate transport apparatus including a drive section having at least one drive shaft and at least two scara arms operably coupled to the at least one drive shaft, the at least one drive shaft being a common drive shaft for the at least two scara arms effecting extension and retraction of the at least two scara arms, wherein the at least two scara arms are coupled to each other so that, with the at least one drive shaft coupled to the at least two scara arms, rotation of the drive shaft effects extension and retraction of one of the at least two scara arms substantially independent of motion of another of the at least two scara arms.

Abstract: A substrate processing apparatus having a transport apparatus, at least one sensor connected to the transport apparatus and a controller. The transport apparatus is adapted for transporting the substrate between processing stations of the processing apparatus. The sensor is capable of sensing the substrate transported by the transporting apparatus. The sensor is arranged for sending at least one signal in response to sensing the substrate. The controller is communicably connected to the sensor and arranged to determine alignment of the substrate in at least two directions, angled relative to each other, relative to a predetermined location. The controller is capable of determining alignment from the at least one signal identifying no more than two points on the substrate and independent of radial variances between substrates.

Abstract: A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads.

Abstract: A load port including a frame defining a load port opening, a substrate carrier interface connected to the frame and configured to removably couple with a substrate carrier shell, a load port door configured to interface with a substrate carrier door, the load port door being movably coupled to frame and having a first position substantially blocking the load port opening, and a second position where the load port opening is substantially unblocked by the load port door, and a door coupling member without moving parts, located on the load port door configured to releasably couple with a corresponding member without moving parts on the substrate carrier door, wherein activation of the door coupling member effects coupling between the load port door and substrate carrier door and a passive release of the substrate carrier door from the substrate carrier shell.

Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier at the load port interface. The carrier holding station is arranged to provide a fast swap section for replacement of the substrate transport carrier from the carrier holding station.

Abstract: A semiconductor workpiece processing system having at least one processing apparatus for processing workpieces, a primary transport system, a secondary transport system and one or more interfaces between first transport system and second transport system. The primary and secondary transport systems each have one or more sections of substantially constant velocity and in queue sections communicating with the constant velocity sections.

Abstract: A substrate processing apparatus having a station for loading and unloading substrates from the apparatus, includes an aperture closure for sealing a loading and unloading aperture of the station, a fluidic magazine door drive for removing a door of a substrate magazine and thus opening the substrate magazine and for operating the aperture closure to open the aperture, and sensor for mapping vertical locations of substrates mounted to the magazine door of the drive. The fluidic magazine door drive may include an encoder different from the sensor, the encoder being configured for determining the vertical location of the sensor.

Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier at the load port interface. The carrier holding station is arranged to provide a fast swap section for replacement of the substrate transport carrier from the carrier holding station.