Patents by Inventor Uma SRIDHAR

Uma SRIDHAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220362904
    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component.
    Type: Application
    Filed: May 17, 2021
    Publication date: November 17, 2022
    Inventors: Sivapackia GANAPATHIAPPAN, Uma SRIDHAR, Yingdong LUO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Sebastian David ROZO, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA, Hou T. NG, Sudhakar MADHUSOODHANAN
  • Publication number: 20220302339
    Abstract: Exemplary processing methods of forming an LED structure on a backplane may include coupling a first transfer substrate with an LED source substrate. The LED source substrate may include a plurality of fabricated LEDs. The coupling of the first transfer substrate may be produced with a first coupling material extending between the first transfer substrate and each LED of the plurality of fabricated LEDs. The methods may include separating the LED source substrate from the LEDs. The methods may include coupling a second transfer substrate with the first transfer substrate. The coupling of the first transfer substrate may be produced with a second coupling material extending between the second transfer substrate and each LED of the plurality of fabricated LEDs. The methods may include separating the first transfer substrate from the second transfer substrate. The methods may include bonding the plurality of fabricated LEDs with a display backplane.
    Type: Application
    Filed: February 14, 2022
    Publication date: September 22, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Hou T. Ng, Nag Patibandla, Uma Sridhar, Sivapackia Ganapathiappan, Mingwei Zhu
  • Publication number: 20220111579
    Abstract: A method of forming a three dimensional object includes dispensing droplets of an electromagnetic energy curable liquid onto a surface to form a plurality of layers of the three dimensional object in liquid form, wherein each droplet forms a layer of liquid on the surface which is larger than a minimum feature size of a structure to be formed by curing the curable liquid, and directing electromagnetic energy capable of curing the liquid and having a beam width intersecting the layer of liquid which is at least as small as the smallest feature of a structure to be formed in the curable liquid.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 14, 2022
    Inventors: Daihua ZHANG, Uma SRIDHAR, Hou T. NG, Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA
  • Publication number: 20210379726
    Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 9, 2021
    Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Rajeev Bajaj, Daniel Redfield, Mayu Felicia Yamamura, Yingdong Luo, Nag B. Patibandla
  • Publication number: 20210379725
    Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 9, 2021
    Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Mayu Felicia Yamamura, Daniel Redfield, Rajeev Bajaj, Yingdong Luo, Nag B. Patibandla
  • Publication number: 20210054222
    Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.
    Type: Application
    Filed: August 18, 2020
    Publication date: February 25, 2021
    Inventors: Yingdong Luo, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Daihua Zhang, Uma Sridhar, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla, Hou T. Ng, Sudhakar Madhusoodhanan
  • Publication number: 20200325353
    Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.
    Type: Application
    Filed: October 30, 2019
    Publication date: October 15, 2020
    Inventors: Uma SRIDHAR, Sivapackia GANAPATHIAPPAN, Ashwin CHOCKALINGAM, Yingdong LUO, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA, Hou T. NG, Sudhakar MADHUSOODHANAN