Abstract: A wafer test and burn-in fixture and methodology including a wafer probe having flexible tabs and a load board coupled to the wafer probe using the flexible tabs. The fixture also includes a bladder which biases the wafer probe to contact a wafer. A temperature control apparatus is provided to control the temperature of the wafer probe and the wafer. Tests are performed on the wafer using built-in self tests or wrap wiring tests.

Abstract: An electrical interconnect structure for connecting a substrate to the next level of packaging or to a semiconductor device. The interconnect structure includes at least two layers of polymeric material, one of the layers having a capture pad and the second of the layers having a bonding pad electrically connected to the capture pad. The bonding pad and the second layer of polymeric material are at the same height so that the bonding pad is level with the second layer of polymeric material. Finally, there is a cap of electrically conducting metallization on the bonding pad and extending beyond the second layer of polymeric material. The cap is of a different composition than the bonding pad.

Abstract: A thin-layer metallization structure in which the final gold layer is deposited by evaporation with the surface onto which it is evaporated maintained at an elevated temperature. By evaporating the uppermost gold layer of the structure at an elevated substrate temperature, the gold atoms have a higher mobility, causing the deposited gold to spread over the edge of the structure and cover the otherwise exposed edges, including the edge at the copper interface.

Abstract: A high density array of pinless electrical, spring connectors are supported in an electrically insulative carrier. The carrier has an array of cavity nests for receiving the spring connectors, locking them into a stable position and functioning as an electrical coupler between corresponding electrical contact pads in stacked modules.

Abstract: An unsupported particulate catalyst especially useful for methanation reactions is prepared by a method comprising fluid-bed roasting agglomerates of nickel sulfide to form a particulate precursor material which can be reduced to composite particles consisting essentially of a nickel-oxide core with a then coherent adherent layer of nickel thereon, the reduced particles being characterized at the surface by the presence of microcapillary pores interconnecting with each other and the outer surface of the particles.

Abstract: To recover chromium from scrap such as superalloy scrap, the feedstock is melted, subjected to controlled oxidation to oxidize and slag off reactive metals, then subjected to sulfidation and slow cooling to produce a coarse-grained solid wherein the bulk of the chromium is present in a phase consisting predominantly of a chromium sulfide.

Abstract: An unsupported particulate catalyst especially useful for methanation reactions is prepared by a method comprising fluid-bed roasting agglomerates of nickel sulfide to form a particulate precursor material which can be reduced to composite particles consisting essentially of a nickel-oxide core with a then coherent adherent layer of nickel thereon, the reduced particles being characterized at the surface by the presence of microcapillary pores interconnecting with each other and the outer surface of the particles.