Abstract: A wafer prober is provided with a tray which supports a wafer at a set position, transports it to a processing position of the wafer and is placed at the processing position; one or more alignment units which position the wafer at the set position with respect to the tray; contact units arranged in number larger than that of the alignment units and performing inspection processing in contact with the wafer at the processing position; and a tray transport portion for transporting the tray supporting the wafer between the alignment unit and the contact unit. The tray is provided with three or more pin holes for allowing movement of the chuck pin in the XYZ? directions, an alignment mark for positioning the wafer, and an alignment portion for positioning the tray itself.

Abstract: A wafer prober is provided with a tray which supports a wafer at a set position, transports it to a processing position of the wafer and is placed at the processing position; one or more alignment units which position the wafer at the set position with respect to the tray; contact units arranged in number larger than that of the alignment units and performing inspection processing in contact with the wafer at the processing position; and a tray transport portion for transporting the tray supporting the wafer between the alignment unit and the contact unit. The tray is provided with three or more pin holes for allowing movement of the chuck pin in the XYZ? directions, an alignment mark for positioning the wafer, and an alignment portion for positioning the tray itself.

Abstract: Reliability of results of a test such as a wafer burn-in test is raised. The present invention is a method for testing a plurality of semiconductor devices in a semiconductor wafer held in a cartridge. Each of the semiconductor devices has electrodes and the cartridge has a lower cartridge portion provided with a chuck holding the semiconductor wafer thereon, and an upper cartridge portion provided with a probe assembly having probes capable of contacting said electrodes. After constituting the cartridge and before placing the cartridge in the thermostatic chamber, a contact check to determine whether or not electrical contact between the electrodes of the semiconductor devices in the cartridge and the probes of the probe assembly is appropriate is performed.

Abstract: Reliability of results of a test such as a wafer burn-in test is raised. The present invention is a method for testing a plurality of semiconductor devices in a semiconductor wafer held in a cartridge. Each of the semiconductor devices has electrodes and the cartridge has a lower cartridge portion provided with a chuck holding the semiconductor wafer thereon, and an upper cartridge portion provided with a probe assembly having probes capable of contacting said electrodes. After constituting the cartridge and before placing the cartridge in the thermostatic chamber, a contact check to determine whether or not electrical contact between the electrodes of the semiconductor devices in the cartridge and the probes of the probe assembly is appropriate is performed.